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• High voltage up to 3000 V

• Typical resistance ratios of 250:1 to a maximum

resistance ratio of 500:1

• Flow solderable

• Tape and reel packaging available

• Termination style: 3-sided wraparound termination or

single termination flip chip available

• Suitable for solderable, epoxy bondable, or wire bondable

applications

• Termination material: solder-coated nickel barrier or

solder coated non-magnetic terminations standard; gold,

palladium silver, platinum gold, platinum silver or platinum

palladium gold terminations available

• Multiple styles, termination materials and configurations,

allow wide design flexibility

• Epoxy bondable or wire bondable non-magnetic

terminations available