Zener Diode Single 2.7V, 5%, 1500Ohm, 500mW Die

Zener diode chips\nAll juntions completely protected with silicon dioxide\n0.5 watts capability with proper heat sinking\nElectrically equivalent to 1N4099 thru 1N4135\nCompatable with all wire bonding and die attach techniques, with the exception of solder relfow.;

Microchip

微芯科技

ZENER DIODE CHIPS

• 1N4614 THRU 1N4627 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/435 • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N4614 THRU 1N4627 • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTAC

文件：112.2 Kbytes 页数：2 Pages

CDI-DIODE

Package：模具；包装：散装 类别：分立半导体产品 二极管 - 齐纳 - 单 描述：VOLTAGE REGULATOR

MICROCHIP

微芯科技

LEADLESS PACKAGE FOR SURFACE MOUNT

• 1N4614UR-1 THRU 1N4627UR-1 AVAILABLE IN JAN, JANTX, JANTXV AND JANS PER MIL-PRF-19500/435 • LEADLESS PACKAGE FOR SURFACE MOUNT • LOW CURRENT OPERATION AT 250 µA • METALLURGICALLY BONDED

文件：109.68 Kbytes 页数：2 Pages

CDI-DIODE

LEADLESS PACKAGE FOR SURFACE MOUNT

• 1N4614UR-1 THRU 1N4627UR-1 AVAILABLE IN JAN, JANTX, JANTXV AND JANS PER MIL-PRF-19500/435 • LEADLESS PACKAGE FOR SURFACE MOUNT • LOW CURRENT OPERATION AT 250 µA • METALLURGICALLY BONDED

文件：122.75 Kbytes 页数：2 Pages

MICROSEMI

美高森美

LEADLESS PACKAGE FOR SURFACE MOUNT

• 1N4614UR-1 THRU 1N4627UR-1 AVAILABLE IN JAN, JANTX, JANTXV AND JANS PER MIL-PRF-19500/435 • LEADLESS PACKAGE FOR SURFACE MOUNT • LOW CURRENT OPERATION AT 250 µA • METALLURGICALLY BONDED

文件：122.75 Kbytes 页数：2 Pages

MICROSEMI

美高森美