NPN SILICON PLANAR EPITAXIAL TRANSISTOR

文件：169.04 Kbytes 页数：3 Pages

CDIL

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

文件：113.09 Kbytes 页数：2 Pages

CDI-DIODE

Multilevel Pipeline Registers

The Am29520A and Am29521A are high「 speed dual stack, register fies that difler only in the way data is loaded (see Table 1)- Both devices contain four 8-bit wide registers whose texible architecture lends itseif to virtually any System, The high output drive allows layout of the devices dire

文件：583.11 Kbytes 页数：12 Pages

AMD

超威半导体