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CD08RK1-S-K-R中文资料CK-COMPONENTS数据手册PDF规格书
CD08RK1-S-K-R规格书详情
Features/Benefits
• Process sealed – withstands
soldering and cleaning
• Thru-hole and surface mount
models
• Compact size saves space –
36 smaller than traditional
10mm DIP
• Crisp, positive detent ensures
actuation
Typical Applications
• Address switching applications
• Data storage devices
• Computer and peripherals
• Instrumentation
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AmphenolLTW |
24+ |
DIP |
17900 |
标准环形连接器X-LOK08PMCONNFPIN |
询价 | ||
C&KComponent |
23+ |
65600 |
询价 | ||||
ROHM/罗姆 |
24+ |
SOT23-5 |
11016 |
公司现货库存,支持实单 |
询价 | ||
24+ |
QFP |
2700 |
全新原装自家现货优势! |
询价 | |||
QUALCOMM |
22+ |
BGA |
8000 |
原装正品支持实单 |
询价 | ||
24+ |
QFP |
32 |
询价 | ||||
C&K |
2021+ |
- |
499 |
询价 | |||
TTELECTRONICS |
25+ |
SMD |
2302 |
原装正品,假一罚十! |
询价 | ||
KOREA |
23+ |
QFP-176 |
5000 |
原装正品,假一罚十 |
询价 | ||
TTELECTRONIC |
24+ |
SMD |
3000 |
全新原装现货 优势库存 |
询价 |
