丝印：CC430F5137；Package：VQFN(RGZ)；CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

文件：2.86639 Mbytes 页数：133 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件：1.3211 Mbytes 页数：118 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件：1.49123 Mbytes 页数：120 Pages

TI

德州仪器

丝印：CC430F5137；Package：VQFN(RGZ)；CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

文件：2.86639 Mbytes 页数：133 Pages

TI

德州仪器

丝印：CC430F5137；Package：VQFN(RGZ)；CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

文件：2.86639 Mbytes 页数：133 Pages

TI

德州仪器

丝印：CC430F5137；Package：VQFN(RGZ)；CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

文件：2.86639 Mbytes 页数：133 Pages

TI

德州仪器

Package：48-VFQFN 裸露焊盘；包装：托盘 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX+MCU ISM\u003c1GHZ 48VFQFN

TI

德州仪器