CC256X开发板套件编程器的射频评估开发套件开发板规格书PDF中文资料

CC256X属于开发板套件编程器的射频评估开发套件开发板。由德州仪器制造生产的CC256X射频评估和开发套件，开发板本系列中的产品适用于在已知实施环境中，提供能访问射频相关器件的功能或者有助于访问该功能。所含的焦点产品范围从射频信号链元器件（如放大器和检测器）到模块化收发器，以及不直接包含焦点产品的适配器硬件，但此类硬件可供方便地访问用户单独提供的特定射频产品或系列。

1.1 Features 1

• TI's Single-Chip Bluetooth Solution With Bluetooth

Basic Rate (BR), Enhanced Data Rate (EDR), and

Low Energy (LE) Support; Available in Two

Variants:

– Dual-Mode Bluetooth CC2564 Controller

– Bluetooth CC2560 Controller

• CC2564 Bluetooth 4.1 Controller Subsystem

Qualified (QDID 58852); Compliant up to the HCI

Layer

• Highly Optimized for Low-Cost Designs:

– Single-Ended 50-Ω RF Interface

– Package Footprint: 76 Terminals, 0.6-mm Pitch,

8-mm x 8-mm mrQFN

• BR/EDR Features Include:

– Up to 7 Active Devices

– Scatternet: Up to 3 Piconets Simultaneously, 1

as Master and 2 as Slaves

– Up to 2 SCO Links on the Same Piconet

– Support for All Voice Air-Coding – Continuously

Variable Slope Delta (CVSD), A-Law, μ-Law,

and Transparent (Uncoded)

– CC2560B/CC2564B Devices Provide an

Assisted Mode for HFP 1.6 Wideband Speech

(WBS) Profile or A2DP Profile to Reduce Host

Processing and Power

– Support of Multiple Bluetooth Profiles With

Enhanced QoS

• LE Features Include:

– Support of Up to 10 (CC2564B) Connections

– Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

– Independent Buffering for LE Allows Large

Numbers of Multiple Connections Without

Affecting BR/EDR Performance.

– Built-In Coexistence and Prioritization Handling

for BR/EDR and LE

• Best-in-Class Bluetooth (RF) Performance

(TX Power, RX Sensitivity, Blocking)

– Class 1 TX Power Up to +10 dBm

– –95 dbm Typical RX Sensitivity

– Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

– Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

– Provides Longer Range, Including 2x Range

Over Other LE-Only Solutions

• Advanced Power Management for Extended

Battery Life and Ease of Design

– On-Chip Power Management, Including Direct

Connection to Battery

– Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

– Shutdown and Sleep Modes to Minimize Power

Consumption

• Physical Interfaces:

– UART Interface With Support for Maximum

Bluetooth Data Rates

• UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

• Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps (CC2560B and

CC2564B Only)

– Fully Programmable Digital PCM-I2S Codec

Interface

• Flexibility for Easy Stack Integration and Validation

Into Various Microcontrollers, Such as MSP430™

and ARM® Cortex®-M3 and Cortex®-M4 MCUs

• CC256x Bluetooth Hardware Evaluation Tool: PCBased

Application to Evaluate RF Performance of

the Device and Configure Service Pack

• Device Pin-to-Pin Compatible With Previous

Devices or Modules

1.2 Applications

• Mobile Accessories

• Sports and Fitness Applications

• Wireless Audio Solutions

• Remote Controls

• Toys

• Test and Measurement

• Industrial: Cable Replacement

• Wireless Sensors

• Automotive Aftermarket

• Point of Service (POS)

• Wellness and Health

1.3 Description

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and

enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device

provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller

unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to

other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software

algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of

operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and

ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod®

(MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode

Bluetooth Stack. Some of the profiles supported include the following:

• Serial port profile (SPP)

• Advanced audio distribution profile (A2DP)

• Audio/video remote control profile (AVRCP)

• Handsfree profile (HFP)

• Human interface device (HID)

• Generic attribute profile (GATT)

• Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including

a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end,

low-power audio solutions.