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XCC1352R1F3RGZR

丝印:CC1352;Package:VQFN;SimpleLink High-Performance Dual-Band Wireless MCU

文件:1.11047 Mbytes 页数:54 Pages

TI

德州仪器

XCC1352P1F3RGZR

丝印:CC1352P1F3;Package:VQFN;SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier

文件:502.43 Kbytes 页数:60 Pages

TI

德州仪器

CC1352P

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

文件:2.9638 Mbytes 页数:72 Pages

TI

德州仪器

CC1352P

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

文件:1.75855 Mbytes 页数:54 Pages

TI

德州仪器

CC1352P

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.63739 Mbytes 页数:69 Pages

TI

德州仪器

CC1352P

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.65151 Mbytes 页数:72 Pages

TI

德州仪器

CC1352P

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.59194 Mbytes 页数:91 Pages

TI

德州仪器

CC1352P

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

文件:2.21766 Mbytes 页数:63 Pages

TI

德州仪器

CC1352P

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:2.60305 Mbytes 页数:59 Pages

TI

德州仪器

CC1352P

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.50774 Mbytes 页数:64 Pages

TI

德州仪器

供应商型号品牌批号封装库存备注价格
xilinx
22+
DIP6
6800
询价
xilinx
23+
DIP6
8000
全新原装
询价
TI
25+23+
QFN40
27266
绝对原装正品全新进口深圳现货
询价
TI/德州仪器
23+
QFN40
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
TI/德州仪器
25+
QFN40
10
全新原装正品支持含税
询价
TI
20+
模块
960
无线通信IC,大量现货!
询价
TI
20+
射频元件
3000
就找我吧!--邀您体验愉快问购元件!
询价
22+
NA
3450
加我QQ或微信咨询更多详细信息,
询价
TI
24+
con
35960
查现货到京北通宇商城
询价
TI
23+
VQFN
5000
全新原装正品现货
询价
更多CC1352供应商 更新时间2025-9-20 9:31:00