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CC1310F32RGZR

丝印:CC1310F32;Package:VQFN(RGZ);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RGZR.B

丝印:CC1310F32;Package:VQFN(RGZ);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RGZT

丝印:CC1310F32;Package:VQFN(RGZ);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RGZT.B

丝印:CC1310F32;Package:VQFN(RGZ);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RHBR

丝印:CC1310F32;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RHBR.B

丝印:CC1310F32;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RHBT

丝印:CC1310F32;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RHBT.B

丝印:CC1310F32;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RSMR

丝印:CC1310F32;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F32RSMR.B

丝印:CC1310F32;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

供应商型号品牌批号封装库存备注价格
TI
24+
QFN
17900
一级授权代理原装现货热卖
询价
TI
16+
VQFN
10000
原装正品
询价
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
询价
TI(德州仪器)
2447
VQFN-48(7x7)
315000
2500个/圆盘一级代理专营品牌!原装正品,优势现货,
询价
TI
25+
射频元件
2255
就找我吧!--邀您体验愉快问购元件!
询价
TI(德州仪器)
2021+
VQFN-48(7x7)
499
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TEXAS INSTRUMENTS
23+
NA
9600
全新原装正品!一手货源价格优势!
询价
TI
22+
48VFQFN
9000
原厂渠道,现货配单
询价
TI/德州仪器
25+
VQFN-48
8880
原装认准芯泽盛世!
询价
更多CC1310F32供应商 更新时间2025-11-24 16:28:00