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CDBQC0130R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130L

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130R

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0130

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lowstoredcharge. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0130L

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供应商型号品牌批号封装库存备注价格
TAOGLAS
24+
con
10000
查现货到京北通宇商城
询价
Taoglas
21+
UMT6SOT-363
10
全新原装鄙视假货
询价
TAOGLAS
21+
N/A
2500
进口原装,优势现货
询价
TAOGLAS
11
询价
TAOGLAS
24+
con
2500
优势库存,原装正品
询价
TAOGLAS
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
LEMO
20+
连接器
293
就找我吧!--邀您体验愉快问购元件!
询价
Lemo
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价
更多CAB.0130供应商 更新时间2025-6-23 14:00:00