MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化