丝印：C75；Package：DO-214AA；Transient Voltage Suppressors (TVS) Data Sheet

Features For surface mounted applications in order to optimize board space Low profile package Built in strain relief Glass p assivated j unction Low inductance Excellent clamping capability 1000W peak pulse power capability at 10/1000 μ s waveform, r epetition r ate (duty cycle): 0.01

文件：1.58341 Mbytes 页数：7 Pages

SY

顺烨电子

丝印：C75；Package：DO-214AA；5.0 To 200V 1000W Surface Mount Transient Voltage Suppressors

Features Glass passivated chip 1000W peak pulse power capability with a 10/1000μs waveform Repetitive rate (duty cycle) : 0.01 Typical IR less than 1μA above 10V Excellent clamping capability Very fast response time High temperature soldering: 260℃/10s at terminals. RoHS compliant

文件：3.35517 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：C75；Package：SC70-5；Tiny SC70-5, SOT23-5 and DFN6-1.0mm*1.5mm Packages

General Description The SN74LVC1G17 is s a single Non−inverting Schmitt Trigger Buffer in three tiny footprint packages. Features ● Tiny SC70-5, SOT23-5 and DFN6-1.0mm*1.5mm Packages ● Source/Sink 24mA at 3.0V ● Chip Complexity: FETs = 20 ● Designed for 1.65V to 5.5V VCC Operation ●

文件：718.4 Kbytes 页数：9 Pages

UMW

友台半导体

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器

丝印：C75；Package：SC70(DCK)；SN74LVC1G17 Single Schmitt-Trigger Buffer

1 Features • Available in ultra small 0.64mm2 package (DPW) with 0.5mm pitch • Supports 5V VCC operation • Inputs accept voltages to 5.5V • Maximum tpd of 4.6ns at 3.3V • Low power consumption, 10μA maximum ICC • ±24mA output drive at 3.3V • Ioff supports live insertion, partial-power-down

文件：2.91081 Mbytes 页数：52 Pages

TI

德州仪器