Teck90 1000V, 3G C #1214 Str BC, XLPE Ins M4, PVC Jkt, AIA Armor, Blk PVC Jkt, CSA HL SUN RES -40C

Product Description Teck90 1000V, 3+G Conductor 12+14AWG (7x20H) Bare Copper, XLPE Insulation M4 Color Code, PVC Inner Jacket, Aluminum Interlock Armor, Black PVC Outer Jacket, CSA HL SUN RES -40C

文件：141.95 Kbytes 页数：2 Pages

BELDEN

百通

Teck90 1000V, 3G C #1214 Str BC, XLPE Ins M4, PVC Jkt, AIA Armor, Blk PVC Jkt, CSA HL SUN RES -40C

Product Description Teck90 1000V, 3+G Conductor 12+14AWG (7x20H) Bare Copper, XLPE Insulation M4 Color Code, PVC Inner Jacket, Aluminum Interlock Armor, Black PVC Outer Jacket, CSA HL SUN RES -40C

文件：141.95 Kbytes 页数：2 Pages

BELDEN

百通

Teck90 1000V, 3G C #1214 Str BC, XLPE Ins M4, PVC Jkt, AIA Armor, Blk PVC Jkt, CSA HL SUN RES -40C

Product Description Teck90 1000V, 3+G Conductor 12+14AWG (7x20H) Bare Copper, XLPE Insulation M4 Color Code, PVC Inner Jacket, Aluminum Interlock Armor, Black PVC Outer Jacket, CSA HL SUN RES -40C

文件：141.95 Kbytes 页数：2 Pages

BELDEN

百通

Teck90 1000V, 3G C #1214 Str BC, XLPE Ins M4, PVC Jkt, AIA Armor, Blk PVC Jkt, CSA HL SUN RES -40C

Product Description Teck90 1000V, 3+G Conductor 12+14AWG (7x20H) Bare Copper, XLPE Insulation M4 Color Code, PVC Inner Jacket, Aluminum Interlock Armor, Black PVC Outer Jacket, CSA HL SUN RES -40C

文件：141.95 Kbytes 页数：2 Pages

BELDEN

百通

250 WATTS (AC) DC/D CSINGLE OUTPUT

250 WATTS (AC) DC/DC SINGLE OUTPUT Features • Single Output • 3U x 21(24)TE x 166.5mm(24TE for 5V outputs) • Weight 1.7kg

文件：405.25 Kbytes 页数：1 Pages

POWERBOX

250 WATTS (AC) DC/D CSINGLE OUTPUT

250 WATTS (AC) DC/DC SINGLE OUTPUT Features • Single Output • 3U x 21(24)TE x 166.5mm(24TE for 5V outputs) • Weight 1.7kg

文件：405.25 Kbytes 页数：1 Pages

POWERBOX

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：1.19794 Mbytes 页数：7 Pages

TDK

东电化

Multilayer Ceramic Chip Capacitors General use

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：173.01 Kbytes 页数：31 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：2.57364 Mbytes 页数：55 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V)

■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo

文件：1.59326 Mbytes 页数：57 Pages

TDK

东电化