OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package

Frequency range 10 MHz – 160 MHz Standard frequencies 10; 12.8; 16.384; 19.2 ; 20; 30.72; 32.768MHz Features Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package OCO1000, C4500 Typical Applications Base Station

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VECTRON

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：1.19794 Mbytes 页数：7 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：2.57364 Mbytes 页数：1 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：1.66928 Mbytes 页数：12 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V)

■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo

文件：1.59326 Mbytes 页数：57 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：2.57112 Mbytes 页数：55 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：1.13758 Mbytes 页数：55 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：2.57112 Mbytes 页数：55 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

文件：1.86627 Mbytes 页数：31 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency

文件：2.57112 Mbytes 页数：55 Pages

TDK

东电化