ESD3Z3V3

Marking：C3；Package：SOD-323；Transient Voltage Suppressors

Features Lowclampingvoltage Lowleakage Transientprotectionforhighspeeddatalinesto IEC61000-4-2(ESD)±15kV(air),±8kV(contact)

KST4126

Marking：C3；Package：SOT-23；General Purpose Transistor

PNPEpitaxialSiliconTransistor

KST4126

Marking：C3；Package：SOT-23；General Purpose Transistor

PNPEpitaxialSiliconTransistor

MM3Z2V7

Marking：C3；Package：SOD-323；SURFACE MOUNT ZENER DIODES

FEATURES •PlanarDieConstruction •Ultra-SmallSurfaceMountPackage •Generalpurpose,MediumCurrent •IdeallySuitedforAutomatedAssemblyProcesses

MM5Z3V0T5G

Marking：C3；Package：SC-79；Voltage regulator diodes

1.Generaldescription General-purposeZenerdiodesinanSOD523(SC-79)ultrasmallflatleadSurface-MountedDevice (SMD)plasticpackage. 2.Featuresandbenefits •Non-repetitivepeakreversepowerdisspation:≤40W •Totalpowerdissipation:≤300mW •Toleranceseries:±2 •Wide

MMBZ5223B

Marking：C3；Package：SOT-23；350mW SURFACE MOUNT ZENER DIODE

PlanarDieConstruction 350mWPowerDissipation 2.4V–51VNominalZenerVoltage 5StandardVzTolerance DesignedforSurfaceMountApplication PlasticMaterial–ULRecognitionFlammability Classification94V-0

MMBZ5223BW

Marking：C3；Package：SOT-323；200mW SURFACE MOUNT ZENER DIODE

PlanarDieConstruction 200mWPowerDissipation 2.4V–51VNominalZenerVoltage 5%StandardVzTolerance DesignedforSurfaceMountApplication PlasticMaterial–ULRecognitionFlammability Classification94V-0

MMSZ5223B

Marking：C3；Package：SOD-123；500mW SURFACE MOUNT ZENER DIODE

PlanarDieConstruction 500mWPowerDissipation 2.4V–51VNominalZenerVoltage 5%StandardVzTolerance DesignedforSurfaceMountApplication PlasticMaterial–ULRecognitionFlammability Classification94V-0

MMSZ5223B

Marking：C3；Package：SOD-123；ZENER DIODES

PlanarDieConstruction 500mWPowerDissipation 2.4V-75VStandoffVoltage 5NominalZenerVoltage DesignedforSurfaceMountApplication PlasticMaterial-ULRecognitionFlammability Classification94V-O ThisisaHalogenFreeDevice AllSMCpartsaretraceabletothewaferlot Additional

MMSZ5223B

Marking：C3；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features PlanarDieConstruction Ultra-SmallSurfaceMountPackage Generalpurpose,MediumCurrent 350mWPowerDissipationOnCeramicPBC IdeallySuitedforAutomatedAssemblyProcesses