首页 >C1608C0G1H470JC>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | TDK | ||
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | TDK | ||
TLV320AIC3104EVMandTLV320AIC3104EVM-PDK | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 | ||
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | TDK | ||
ContainsallsupportcircuitryneededfortheADS1148/ADS1248 | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 | ||
ContainsallsupportcircuitryneededfortheADS1146/ADS1246 | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 |
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