MULTILAYER CERAMIC CHIP CAPACITORS

文件：518.51 Kbytes 页数：15 Pages

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东电化

Package：0201（0603 公制）；包装：卷带（TR）剪切带（CT） 类别：电容器 陶瓷电容器 描述：CAP CER 2.4PF 25V C0G 0201

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东电化

Package：0201（0603 公制）；包装：卷带（TR）剪切带（CT） 类别：电容器 陶瓷电容器 描述：CAP CER 2.4PF 25V C0G 0201

TDK

东电化

Multilayer Ceramic Chip Capacitors

文件：173.01 Kbytes 页数：31 Pages

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东电化

Multilayer Ceramic Chip Capacitors General use

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：173.01 Kbytes 页数：31 Pages

TDK

东电化

Multilayer Ceramic Chip Capacitors General use

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

文件：173.01 Kbytes 页数：31 Pages

TDK

东电化