BYM26F中文资料飞利浦数据手册PDF规格书
BYM26F规格书详情
DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack
• Also available with preformed leads for easy insertion.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
INFINEON |
2016+ |
模块 |
985 |
只做原装现货!或订货! |
询价 | ||
PHI |
23+ |
SOD64 |
8560 |
受权代理!全新原装现货特价热卖! |
询价 | ||
PHI |
23+ |
SOD64 |
7300 |
专注配单,只做原装进口现货 |
询价 | ||
PHI |
22+ |
SOD-64 |
8000 |
原装正品支持实单 |
询价 | ||
BROADCOM |
24+ |
QFN |
6618 |
公司现货库存,支持实单 |
询价 | ||
Infineon |
2000 |
1 |
公司优势库存 热卖中!! |
询价 | |||
PHI |
24+ |
NA/ |
30000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
Infineon/英飞凌 |
2021+ |
Module |
9600 |
原装现货,欢迎询价 |
询价 | ||
PHI |
24+ |
SOD-64 |
60000 |
全新原装现货 |
询价 | ||
欧派克 |
23+ |
NA |
6500 |
全新原装假一赔十 |
询价 |