BY558中文资料飞利浦数据手册PDF规格书
BY558规格书详情
DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Also available with preformed leads for easy insertion
• Designed to withstand transients up to 1700 V.
APPLICATIONS
• For use in multi-sync monitor horizontal deflection circuits
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
24+ |
TO220 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
询价 | ||
恩XP |
24+ |
SMD |
5500 |
长期供应原装现货实单可谈 |
询价 | ||
恩XP |
2026+ |
TO-220F |
500 |
原装正品,假一罚十! |
询价 | ||
N/A |
23+ |
NA |
276 |
专做原装正品,假一罚百! |
询价 | ||
恩XP |
NA |
5500 |
一级代理 原装正品假一罚十价格优势长期供货 |
询价 | |||
SI |
25+ |
50 |
公司优势库存 热卖中! |
询价 | |||
Bychip/百域芯 |
21+ |
SOT-89 |
30000 |
实单必成 质强价优 可开13点增值税 |
询价 | ||
EIC |
24+ |
100 |
询价 | ||||
PHI |
05+ |
原厂原装 |
211 |
只做全新原装真实现货供应 |
询价 | ||
PHI |
25+ |
SOD |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
询价 |
