BUK7S1R0-40H数据手册Nexperia中文资料规格书

描述 Description

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.

特性 Features

• Fully automotive qualified to beyond AEC-Q101:
• -55 °C to +175 °C rating suitable for thermally demanding environments

• LFPAK88 package:
• Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
• Thin package and copper clip enables LFPAK88 to be highly efficient thermally

• LFPAK copper clip technology enabling improvements over wire bond packages by:
• Increased maximum current capability and excellent current spreading
• Improved RDSon
• Low source inductance
• Low thermal resistance Rth

• LFPAK Gull Wing leads:
• Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
• Visual (AOI) soldering inspection, no need for expensive x-ray equipment
• Easy solder wetting for good mechanical solder joint

• Unique 40 V Trench 9 superjunction technology:
• Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
• Improved SOA and avalanche capability compared to standard TrenchMOS
• Tight VGS(th) limits enable easy paralleling of MOSFETs

应用 Application

• 12 V automotive systems
• 48 V DC/DC systems (on 12 V secondary side)
• Higher power motors, lamps and solenoid control
• Reverse polarity protection
• LED lighting
• Ultra high performance power switching