首页>BUF634AIDDAR>规格书详情

BUF634AIDDAR中文资料德州仪器数据手册PDF规格书

PDF无图
厂商型号

BUF634AIDDAR

功能描述

BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer

丝印标识

BF634A

封装外壳

SOPowerPAD(DDA)

文件大小

3.53712 Mbytes

页面数量

47

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-11-3 23:10:00

人工找货

BUF634AIDDAR价格和库存,欢迎联系客服免费人工找货

BUF634AIDDAR规格书详情

1 Features

• Pin-Selected Bandwidth: 35 MHz to 210 MHz

• High Output Current: 250 mA

• Slew Rate: 3750 V/μs

• Low Quiescent Current: 1.5 mA (35-MHz BW)

• Wide Supply Range: ±2.25 V to ±18 V

• Internal Output Current Limit

• Thermal Shutdown Protection

• Available in Packages with Thermal Pad

• Extended Temperature Operation:

–40°C to +125°C

2 Applications

• Memory, Semiconductor Testers

• Test Equipment

• Headphone Drivers

• Flight Control Systems

• Capacitive Load Drivers

• Valve Drivers, Solenoid Drivers

• Line Drivers

3 Description

The BUF634A device is a high-performance, highfidelity,

open-loop buffer that is capable of driving 250

mA of output current. The BUF634A is a 36-V device

with an adjustable bandwidth of 35 MHz to 210 MHz,

which is accomplished by varying the value of an

external resistor between the V– and BW pins.

The BUF634A device can be used as a standalone

open-loop driver, or used inside the feedback loop of

a precision op amp to provide both high-precision and

large output current drive with improved capacitive

load drive.

For low-power applications, the BUF634A device

operates on a 1.5-mA quiescent current with a

250-mA output, 3750-V/μs slew rate, and 35-MHz

bandwidth. The device consumes 8.5-mA quiescent

current in wide-bandwidth mode with a 210-MHz

bandwidth. The BUF634A is fully protected by an

internal current limit in its output stage and by thermal

shutdown, making the device rugged and easy to use.

The BUF634A device is rated to function over the

extended industrial temperature range of –40°C to

+125°C. The BUF634A comes in three packages: D

(SOIC), DRB (VSON), and DDA (HSOIC). The DRB

(VSON) and DDA (HSOIC) packages have excellent

thermal performance resulting from the thermal pad

on the bottom side. The DRB package comes in a

very small form factor of 3.0 mm × 3.0 mm, making

the device a very suitable option for portable and sizeconstrained

applications.

供应商 型号 品牌 批号 封装 库存 备注 价格
TI
24+
SOP8
39500
进口原装现货 支持实单价优
询价
TI(德州仪器)
24+
SOP-8
10548
原厂可订货,技术支持,直接渠道。可签保供合同
询价
TI(德州仪器)
24+
NA/
8735
原厂直销,现货供应,账期支持!
询价
TI/德州仪器
2022+
SOIC-8
1000
只做原装,可提供样品
询价
TI(德州仪器)
23+
SOIC-8
13650
公司只做原装正品,假一赔十
询价
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价
TI(德州仪器)
2526+
SOIC-8
50000
只做原装优势现货库存,渠道可追溯
询价
22+
5000
询价
TI/德州仪器
2023+
SOIC8
15000
一级代理优势现货,全新正品直营店
询价
TI
23+
SOIC-8
5000
全新原装,支持实单,非诚勿扰
询价