BU1008-E3SLASH51中文资料威世科技数据手册PDF规格书

FEATURES

• UL recognition file number E312394

• Thin single in-line package

• Glass passivated chip junction

• Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S)

• Superior thermal conductivity

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

    General purpose use in AC/DC bridge full wave rectification for switching power supply, home appliances and white-goods applications.