NPN Built-in Resistor Transistor CMPAK Series Inverter, Driver, Switching

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HITACHIHitachi Semiconductor

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NPN Built-in Resistor Transistor CMPAK Series Inverter, Driver, Switching

HITACHI

日立

Glass Fibre Cloth

Description: Construction : Substrate material, primer, adhesive Premier coating, adhesive : American dow corning silicone adhesive Substrate material : Glass fibre cloth Feature : Pressure-sensitive adhesive, no remaining adhesive, antistatic, heat-resist, anti corrosion

文件：499.79 Kbytes 页数：1 Pages

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Ultra fast low-loss rectifier

DESCRIPTION Cavity free cylindrical glass SOD81 package through Implotec™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • E

文件：65.15 Kbytes 页数：8 Pages

PHI

PHI

DUAL SCHOTTKY BARRIER DIODE IN TO220 METAL PACKAGE FOR HI.REL APPLICATIONS

FEATURES • HERMETIC TO220 METAL PACKAGE • ISOLATED CASE • SCREENING OPTIONS AVAILABLE • OUTPUT CURRENT 30A • LOW VF ( VF

文件：17.48 Kbytes 页数：2 Pages

SEME-LAB