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BCM85652中文资料MicroWave MODEM Dual-core modem, with Wide Band IF DSP, High Capacity数据手册MaxLinear规格书

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厂商型号

BCM85652

功能描述

MicroWave MODEM Dual-core modem, with Wide Band IF DSP, High Capacity

制造商

MaxLinear MaxLinear.

中文名称

迈凌 迈凌微电子有限公司

数据手册

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更新时间

2025-9-27 17:01:00

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BCM85652规格书详情

描述 Description

The MaxLinear BCM85652 is a fifth-generation SoC for broadband wireless transmission systems. The BCM85652 brings the most advanced features and performance to the microwave point-to-point industry with high capacity features such as 4 x 4 XPIC MIMO, wide 112MHz channels, high 4096 QAM modulation, and dual channel on a single I/Q or IF AFE interface.

 

The BCM85652 supports high integration with two modems (e.g., full XPIC in a single chip), embedded programmable DSP for addon features and differentiation, multiple high-speed AFE for I/Q and IF interface, auxiliary AFE for RF circuitry and board control, packet fragmentation and header compression, SyncE, and 1588 support.

 High link robustness is supported with Enhanced Carrier Recovery (ECR), ACM, advanced multilevel LDPC/RS FEC, MRC and XPIC-MRC, and link protection. An integrated digital tuner replaces the need for an external IF tuner. Improved RF performance is provided with RF circuitry impairments compensation including I/Q imbalances correction, ECR, multi-stage AGC, and Adaptive Digital Predistortion (ADPD).

Advanced power saving uses power domains, clock gating, and AVS that are optimized for a 28nm process. The BCM85652 meets the evolving demands of backhaul networks, and supports hybrid and pure IP networks for 4G cellular networks.

特性 Features

Link Robustness
·ECR
·ACM
·Advanced multilevel LDPC and RS FEC
·Maximal Ratio Combining (MRC) and Dual Polarization (XPIC) MRC for extra link robustness and channel diversity notch elimination
High Capacity
·Dual polarization spatial multiplexing MIMO (4 x 4 XPIC-MIMO)
·Full XPIC in a single chip
·Two modem chains
·112MHz channel on each modem chain
·High QAM modulations up to 4096 QAM
·Channel bonding
·Dual channel on single Baseband (BB) or IF interface
·PLA
·Header compression

应用 Application

·MicroWave point-to-point

供应商 型号 品牌 批号 封装 库存 备注 价格
恩XP
21+
SOT363
3000
原装优势 实单必成 可开13点发票
询价
恩XP
25+23+
SOT363
42968
绝对原装正品全新进口深圳现货
询价
恩XP
23+
标准封装
6000
正规渠道,只有原装!
询价
BROADCOM
24+
BGA
37279
郑重承诺只做原装进口现货
询价
NEXPERIA/安世
23+
NA
12730
原装正品代理渠道价格优势
询价
BROADCOM
2023+
BGA
8635
一级代理优势现货,全新正品直营店
询价
MAXLINEAR
原厂封装
9800
原装进口公司现货假一赔百
询价
NEXPERIA/安世
22+
SOT-363
10990
原装正品
询价
恩XP
24+
SOT363
9600
原装现货,优势供应,支持实单!
询价
恩XP
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价