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BCM85652数据手册MaxLinear中文资料规格书

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厂商型号

BCM85652

功能描述

MicroWave MODEM Dual-core modem, with Wide Band IF DSP, High Capacity

制造商

MaxLinear MaxLinear. All Rights Reserved.

中文名称

迈凌 迈凌微电子有限公司

数据手册

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更新时间

2025-8-8 9:51:00

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BCM85652价格和库存,欢迎联系客服免费人工找货

BCM85652规格书详情

描述 Description

The MaxLinear BCM85652 is a fifth-generation SoC for broadband wireless transmission systems. The BCM85652 brings the most advanced features and performance to the microwave point-to-point industry with high capacity features such as 4 x 4 XPIC MIMO, wide 112MHz channels, high 4096 QAM modulation, and dual channel on a single I/Q or IF AFE interface.

 

The BCM85652 supports high integration with two modems (e.g., full XPIC in a single chip), embedded programmable DSP for addon features and differentiation, multiple high-speed AFE for I/Q and IF interface, auxiliary AFE for RF circuitry and board control, packet fragmentation and header compression, SyncE, and 1588 support.

 High link robustness is supported with Enhanced Carrier Recovery (ECR), ACM, advanced multilevel LDPC/RS FEC, MRC and XPIC-MRC, and link protection. An integrated digital tuner replaces the need for an external IF tuner. Improved RF performance is provided with RF circuitry impairments compensation including I/Q imbalances correction, ECR, multi-stage AGC, and Adaptive Digital Predistortion (ADPD).

Advanced power saving uses power domains, clock gating, and AVS that are optimized for a 28nm process. The BCM85652 meets the evolving demands of backhaul networks, and supports hybrid and pure IP networks for 4G cellular networks.

特性 Features

Link Robustness
·ECR
·ACM
·Advanced multilevel LDPC and RS FEC
·Maximal Ratio Combining (MRC) and Dual Polarization (XPIC) MRC for extra link robustness and channel diversity notch elimination
High Capacity
·Dual polarization spatial multiplexing MIMO (4 x 4 XPIC-MIMO)
·Full XPIC in a single chip
·Two modem chains
·112MHz channel on each modem chain
·High QAM modulations up to 4096 QAM
·Channel bonding
·Dual channel on single Baseband (BB) or IF interface
·PLA
·Header compression

应用 Application

·MicroWave point-to-point

供应商 型号 品牌 批号 封装 库存 备注 价格
恩XP
23+
SC70-6
8650
受权代理!全新原装现货特价热卖!
询价
BROADCOM
23+
BGA
50000
全新原装正品现货,支持订货
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BROADCOM
2023+
BGA
8635
一级代理优势现货,全新正品直营店
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BROADCOM/博通
2450+
BGA
9485
只做原装正品现货或订货假一赔十!
询价
恩XP
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价
BROADCOM
2020+
BGA
420
原装现货,优势渠道订货假一赔十
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BROADCOM
22+
BGA
20000
原装现货,实单支持
询价
Broadcom(博通)
23+
15000
专业帮助客户找货 配单,诚信可靠!
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恩XP
21+
SOT363
3000
全新原装 公司现货 价优
询价
BROADCOM
23+
BGA
5000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
询价