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BCM61630数据手册Broadcom中文资料规格书

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厂商型号

BCM61630

功能描述

Femtocell and Small Cell Base Station Chip with Integrated RF and Baseband Modem

制造商

Broadcom Broadcom Corporation.

中文名称

博通公司 博通半导体

原厂标识
数据手册

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更新时间

2025-8-6 12:30:00

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BCM61630规格书详情

描述 Description

The BCM61630 single-chip device boosts data speeds to home-based 3G femtocells.Broadcom’s BCM61630 is a highly integrated digital baseband processor and RF transceiver designed for 3G femtocell residential access points. The System on a Chip (SoC) provides mobile operator OEMs and ODMs with a powerful, low-cost, power-efficient device to support small-cell strategies and meet growing mobile traffic demands. Embedding a high-speed CPU and Broadcom's field-proven Layer 1 modem and peripherals, these devices provide a complete low-power, single-chip solution for residential and small-enterprise 3G small-cell deployments.

特性 Features

·Highly integrated CMOS device
·Second generation in Broadcom's line of WCDMA femtocell access point SoCs
·High HSPA data rates with maximum throughput at up to 21.6 Mb/s
·Advanced SON and sniffing capabilities without addition of external components
·Highly integrated multiband RF and soft GPS receiver enable ultra-low power3 and lowest-cost bill of materials
·USIM Interface

技术参数

  • 制造商编号

    :BCM61630

  • 生产厂家

    :Broadcom

  • OEM

  • Distrib. Inventory

    :No

  • Package

  • I/O Controller

  • Internal Memory

  • Bus Interface

  • Transfer Rates

  • External Memory Interfaces

  • Market Segment

    :Enterprise Access Points

供应商 型号 品牌 批号 封装 库存 备注 价格
原装BROAD
23+
BGA
8560
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BROADCOM
25+
BGA
1000
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BROADCOM
24+
BGA
11016
公司现货库存,支持实单
询价
BROADCOM
23+
BGA
3000
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主营BROADCO
BGA
2350
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BROADCOM
2447
BGA
100500
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BROADCOM
19+
BGA
8900
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BROADCOM
23+
BGA
7300
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BROADCOM
2318+
BGA
6800
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BROADCOM
23+
BGA
50000
全新原装正品现货,支持订货
询价