BCM5704C中文资料博通公司数据手册PDF规格书

OVERVIEW

The BCM5704C is a fully integrated dual-port, 10/100/1000BASE-T Gigabit Ethernet (GbE) MAC and physical layer transceiver solution for high-performance network applications. The BCM5704C is a highly integrated solution combining two triple-speed, IEEE 802.3-compliant MACs, PCI, and PCI-X bus interfaces, an on-chip buffer memory, and an integrated physical layer transceiver in a single device. The BCM5704C is fabricated in a low-voltage, 0.13 µm CMOS process providing a low-power system solution. By itself, the BCM5704C provides a complete single-chip dual-port GbE NIC or LOM solution.

FEATURES

• Single-chip, dual-port solution for dual LAN on Motherboard (LOM) and network interface card (NIC) applications

• Two integrated 10BASE-T/100BASE-TX/1000BASE-T transceivers

• Two 10/100/1000 triple-speed MACs

• Single host interface

- PCI v2.2 32/64-bit, 33/66 MHz

- PCI-X v1.0 64-bit, 66/100/133 MHz

• Dual ultradeep 64 KB on-chip packet buffer

• Dual high-speed RISC cores with 16 KB caches

- Programmable, in-line packet classification

• SMBus 2.0 controller

• On-chip power circuit controller and Wake-on-LAN (WOL) power switching circuit

• Performance features

• TCP, IP, UDP checksum

• TCP segmentation

• CPU task offload

• Adaptive interrupts

• Ultradeep 64 KB packet buffer

• Robust manageability

• PXE 2.0 remote boot

• Alert Standard Format: ASF 1.0 support

• WOL

• Out-of-box WOL

• Intelligent Platform Management Interface (IPMI), ver. 1.5

• Statistic gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB)

• Comprehensive diagnostic and configuration software suite

• ACPI 1.1a-compliant (multiple power modes)

• Advanced network features

• Priority queuing: 802.1p Layer 2 priority encoding; support for four priority queues

• Virtual LANs: 802.1q VLAN tagging; support for up to 64 VLANs

• Jumbo frames (9 KB)

• IEEE 802.3x flow control

• Advanced server features

• Link aggregation: IEEE 802.3ad, GEC/FEC, Smart Load Balancing (supports heterogeneous teams)

• Heterogeneous, mixed speed failover

• Hot-Plug PCI support

• Low-power, 0.13 µm CMOS design

• 300-pin HBGA package

• 3.3V I/Os (5V tolerant)

• JTAG