首页 >BCM1160KFBG>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
piezoaudiotransducer | CUI CUI Inc. | CUI | ||
TranshieldCP1000Series | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
TranshieldCP1000Series | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
SurfaceMountZenerDiode Features Idealforsurfacemountapplications Easypickandplace 5&10voltagetolerancesavailable Widevoltagerange MeetsULspecification94V-0 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode Features -Glasspassivatedchip. -Lowleakage. -Foruseinstabilizingandclippingwithhighpowerrating. -Built-instrainrelief. -Lowinductance. -Highpeakreversepowerdissipation. Mechanicaldata -Case:JEDECDO-214AC,moldedplastic. -Epoxy:UL94V-0rateflameretardant. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode Features -Glasspassivatedchip. -Lowleakage. -Foruseinstabilizingandclippingwithhighpowerrating. -Built-instrainrelief. -Lowinductance. -Highpeakreversepowerdissipation. Mechanicaldata -Case:JEDECDO-214AC,moldedplastic. -Epoxy:UL94V-0rateflameretardant. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode Features -Glasspassivatedchip. -Lowleakage. -Foruseinstabilizingandclippingwithhighpowerrating. -Built-instrainrelief. -Lowinductance. -Highpeakreversepowerdissipation. Mechanicaldata -Case:JEDECDO-214AC,moldedplastic. -Epoxy:UL94V-0rateflameretardant. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
PROGRAMMABLEGND/OPN&28V/OPNDISCRETEINPUTINTERFACEIC | DEIAZ Device Engineering Incorporated | DEIAZ | ||
PROGRAMMABLEGND/OPN&28V/OPNDISCRETEINPUTINTERFACEIC | DEIAZ Device Engineering Incorporated | DEIAZ | ||
PROGRAMMABLEGND/OPN&28V/OPNDISCRETEINPUTINTERFACEIC | DEIAZ Device Engineering Incorporated | DEIAZ |
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