BAQ806数据手册恩XP中文资料规格书

描述 Description

DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.APPLICATIONS
• RF attenuator with low distortion for frequencies above 100 kHz.

特性 Features

• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.