B74121U0055M060中文资料TDK株式会社数据手册PDF规格书

特性 Features

 Bidirectional ESD protection of one high speed I/O line

 ESD protection to IEC 61000-4-2, VESD,max = 15 kV

 Surge protection to IEC 61000-4-5, IPP,max = 7.0 A

 Very low clamping voltage: typical 4.1 V at ITLP = 8 A

 Very low leakage current: typical below 1 nA at 5.5 V

 Low capacitance: typical C = 0.55 pF at 1 MHz

 Ultra-small chip scale package with a height of 0.15 mm

Applications

 High-speed interfaces in smartphones, laptops, tablets, wearables and network communication devices and other portable devices with tight space requirements

 USB

 HDMI

 Thunderbolt

 Firewire

 DVI

 Display port

 S-ATA

 SWP / NFC

 Other high-speed interfaces