High Gain Power Amplifier for 802.11bg WLAN Systems

Description This power amplifier (PA) is designed for high-performance 802.11b and 802.11g multi-mode applications such as Mini PCI and PCMCIA for portable devices and access points. The low profile plastic package with internal input matching to 50Ω and on-chip interstage matching minimizes th

文件：411.29 Kbytes 页数：15 Pages

Atmel

爱特梅尔

High Gain Power Amplifier for 802.11b/g WLAN Systems

Description\nThis power amplifier (PA) is designed for high-performance 802.11b and 802.11g multi-mode applications such as Mini PCI and PCMCIA for portable devices and access points. The low profile plastic package with internal input matching to 50Ω and on-chip interstage matching minimizes the PC • Frequency Range 2.4 GHz to 2.5 GHz\n• Supply Voltage 2.7V to 3.6V\n• 32 dB Power Gain\n• 23 dBm Linear Output Power for IEEE 802.11b Mode Operation\n• EVM < 2.0% at 19 dBm Output Power for IEEE 802.11g Mode Operation\n• On-chip Power Detector with 20 dB Dynamic Range\n• Power-down Mode and Bia;

Microchip

微芯科技

High Gain Power Amplifier for 802.11bg WLAN Systems

Description This power amplifier (PA) is designed for high-performance 802.11b and 802.11g multi-mode applications such as Mini PCI and PCMCIA for portable devices and access points. The low profile plastic package with internal input matching to 50Ω and on-chip interstage matching minimizes th

文件：411.29 Kbytes 页数：15 Pages

Atmel

爱特梅尔

High Gain Power Amplifier for 802.11bg WLAN Systems

Description This power amplifier (PA) is designed for high-performance 802.11b and 802.11g multi-mode applications such as Mini PCI and PCMCIA for portable devices and access points. The low profile plastic package with internal input matching to 50Ω and on-chip interstage matching minimizes th

文件：411.29 Kbytes 页数：15 Pages

Atmel

爱特梅尔

High Gain Power Amplifier for 802.11bg WLAN Systems

Description This power amplifier (PA) is designed for high-performance 802.11b and 802.11g multi-mode applications such as Mini PCI and PCMCIA for portable devices and access points. The low profile plastic package with internal input matching to 50Ω and on-chip interstage matching minimizes th

文件：411.29 Kbytes 页数：15 Pages

Atmel

爱特梅尔

包装：散装 类别：开发板，套件，编程器 射频评估和开发套件，开发板 描述：BOARD EVAL FRO ATR ATR7032

Microchip

微芯科技

Package：16-VFQFN 裸露焊盘；包装：卷带（TR） 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC RF AMP ISM 2.4GHZ 16QFN

Microchip

微芯科技

Package：16-VFQFN 裸露焊盘；包装：卷带（TR） 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC RF AMP ISM 2.4GHZ 16QFN

Microchip

微芯科技