AT25XE021A集成电路（IC）的存储器规格书PDF中文资料

特性 Features

• Single 1.65 V - 3.6 V Supply

• Serial Peripheral Interface (SPI) Compatible

• Supports SPI Modes 0 and 3

• Supports Dual-I/O Operation

• 70 MHz Maximum Operating Frequency

• Clock-to-Output (tV) of 6 ns

• Flexible, Optimized Erase Architecture for Code and Data Storage Applications

• Small (256-Byte) Page Erase

• Uniform 4-kByte Block Erase

• Uniform 32-kByte Block Erase

• Uniform 64-kByte Block Erase

• Full Chip Erase

• Hardware-Controlled Locking of Protected Sectors via WP Pin

• 128-byte, One-Time Programmable (OTP) Security Register

• 64 bytes factory programmed with a unique identifier

• 64 bytes user programmable

• Flexible Programming

• Byte/Page Program (1 to 256 Bytes)

• Dual-Input Byte/Page Program (1 to 256 Bytes)

• Sequential Program Mode Capability

• Fast Program and Erase Times

• 2 ms Typical Page Program (256 Bytes) Time

• 45 ms Typical 4-kByte Block Erase Time

• 360 ms Typical 32-kByte Block Erase Time

• 720 ms Typical 64-kByte Block Erase Time

• Automatic Checking and Reporting of Erase/Program Failures

• Software-Controlled Reset

• JEDEC Standard Manufacturer and Device ID Read Methodology

• Low Power Dissipation

• 200 nA Ultra-Deep Power-Down current (Typical)

• 4.5 µA Deep Power-Down Current (Typical)

• 25 uA Standby Current (Typical)

• 3 mA Active Read Current (Typical)

• Endurance: 100,000 Program/Erase Cycles

• Data Retention: 20 Years

• Complies with Full Industrial Temperature Range

• Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

• 8-lead SOIC (150-mil)

• 8-pad Ultra Thin DFN (2 x 3 x 0.6 mm)

• 8-pad Ultra Thin DFN (5 x 6 x 0.6 mm)

• 8-lead TSSOP Package

• 8-ball WLCSP