AT25DF321A集成电路（IC）的存储器规格书PDF中文资料

Description

The Atmel® AT25DF321A is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25DF321A, with its erase granularity as small as 4-Kbytes, makes it ideal for data storage as well, eliminating the need for additional data storage EEPROM devices.

Features

• Single 2.7V - 3.6V Supply

• Serial Peripheral Interface (SPI) Compatible

– Supports SPI Modes 0 and 3

– Supports Atmel RapidS Operation

– Supports Dual-Input Program and Dual-Output Read

• Very High Operating Frequencies

– 100MHz for Atmel RapidS

– 85MHz for SPI

– Clock-to-Output (tV) of 5ns Maximum

• Flexible, Optimized Erase Architecture for Code + Data Storage Applications

– Uniform 4-Kbyte Block Erase

– Uniform 32-Kbyte Block Erase

– Uniform 64-Kbyte Block Erase

– Full Chip Erase

• Individual Sector Protection with Global Protect/Unprotect Feature

– 64 Sectors of 64-Kbytes Each

• Hardware Controlled Locking of Protected Sectors via WP Pin

• Sector Lockdown

– Make Any Combination of 64-Kbyte Sectors Permanently Read-Only

• 128-Byte Programmable OTP Security Register

• Flexible Programming

– Byte/Page Program (1- to 256-Bytes)

• Fast Program and Erase Times

– 1.0ms Typical Page Program (256-Bytes) Time

– 50ms Typical 4-Kbyte Block Erase Time

– 250ms Typical 32-Kbyte Block Erase Time

– 400ms Typical 64-Kbyte Block Erase Time

• Program and Erase Suspend/Resume

• Automatic Checking and Reporting of Erase/Program Failures

• Software Controlled Reset

• JEDEC Standard Manufacturer and Device ID Read Methodology

• Low Power Dissipation

– 12mA Active Read Current (Typical at 20MHz)

– 5µA Deep Power-Down Current (Typical)

• Endurance: 100,000 Program/Erase Cycles

• Data Retention: 20 Years

• Complies with Full Industrial Temperature Range

• Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

– 8-lead SOIC (208-mil wide)

– 8-pad Ultra Thin DFN (5 x 6 x 0.6mm)