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零件编号	下载&订购	功能描述	制造商&上传企业	LOGO
BES0330	文件：111.29 Kbytes Page：2 Pages	InductiveSensors	BalluffBalluff Korea Ltd. 巴鲁夫巴鲁夫自动化（上海）有限公司	Balluff
CDBF0330	文件：74.45 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0330-HF	文件：196.66 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0330	文件：73.73 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0330-HF	文件：125.02 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0330	文件：74.63 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0330-HF	文件：196.68 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0330-HF	文件：126.15 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0330	文件：73.97 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0330-HF	文件：124.93 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CMM0330	文件：34.83 Kbytes Page：2 Pages	824to928MHz3V,30.5dBmMulti-ModePowerAmplifier [Celeritek] Description TheCMM0330isahighlyefficient3V,multi-modepoweramplifierintendedforuseinportablecellularhandsetsanddatacomproductsoperatingintheAMPSand902-928MHzbands.Asapin-compatiblememberofthenewTrinitiDX™amplifierfamily,theCMM0330offersmaximu	ETC1List of Unclassifed Manufacturers 未分类制造商	ETC1
CMM0330-AK	文件：34.83 Kbytes Page：2 Pages	824to928MHz3V,30.5dBmMulti-ModePowerAmplifier [Celeritek] Description TheCMM0330isahighlyefficient3V,multi-modepoweramplifierintendedforuseinportablecellularhandsetsanddatacomproductsoperatingintheAMPSand902-928MHzbands.Asapin-compatiblememberofthenewTrinitiDX™amplifierfamily,theCMM0330offersmaximu	ETC1List of Unclassifed Manufacturers 未分类制造商	ETC1
ENS-0330	文件：1.21217 Mbytes Page：2 Pages	OverCurrentVoltageProtection	etc2List of Unclassifed Manufacturers etc2未分类制造商	etc2
FCR0330	文件：136.07 Kbytes Page：1 Pages	0.3AmpSiliconControlledRectifiersVOID-FREEGLASSPASSIVATEDCHIPS	FCI Amphenol ICC	FCI
FX0330	文件：1.57224 Mbytes Page：18 Pages	FUSEHOLDERS	BULGIN BULGIN COMPONENTS PLC	BULGIN
FX0330	文件：110.72 Kbytes Page：1 Pages	PCMountingPC1,PC2andPC3	BULGIN BULGIN COMPONENTS PLC	BULGIN
KAI-0330	文件：265.24 Kbytes Page：25 Pages	InterlineCCDImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
KAI-0330-AAA-CP-AE	文件：265.24 Kbytes Page：25 Pages	InterlineCCDImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
KAI-0330-AAA-CP-BA	文件：265.24 Kbytes Page：25 Pages	InterlineCCDImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
KAI-0330-ABA-CB-AA	文件：265.24 Kbytes Page：25 Pages	InterlineCCDImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI

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供应商	型号	品牌	批号	封装	库存	备注	价格
鑫勃源（上海北京青岛）有限公司	AT0330	TEMEXCOMPONENTS	23+	标准封装	18000		询价
深圳市维尔达电子有限公司	AT0330	TEMEXCOMPONE	2023+		80000	一级代理/分销渠道价格优势十年芯程一路只做原装正品	询价
贸泽芯城（深圳）电子科技有限公司	AT03300R	ATC	2021+	DFN3X3-8	28888	原厂授权代理,海外优势订货渠道。可提供大量库存,详	询价
深圳兆威电子有限公司	AT0331-R	ATMEL	2019		55000	专营原装正品现货	询价
艾睿国际（香港）有限公司	AT0331-R	ATMEL/爱特梅尔	2021+	BGA	100500	一级代理专营品牌!原装正品,优势现货,长期排单到货	询价
北京京北通宇电子元件有限公司	AT0341-CuH-S	AOTE奥特	23+	SOP-8	50000	现货常备产品原装可到京北通宇商城查价格	询价
齐创科技(上海,北京,青岛)有限公司	AT04	ATMEL	23+	TSOP8	5000	原装正品,假一罚十	询价
深圳市一线半导体有限公司	AT04	3COM	N/A	SOP	2937		询价
深圳市昌和盛利电子有限公司	AT04	PHILIPS	23+	SOP08	12300		询价
深圳市壹芯创科技有限公司	AT04	INTERSIL	22+	SOP-8	8200	原装现货库存.价格优势!!	询价

更多AT0330供应商更新时间2024-5-30 17:12:00

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