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APQ8096SG数据手册Qualcomm中文资料规格书

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厂商型号

APQ8096SG

功能描述

Application Processors

制造商

Qualcomm QUALCOMM ATHEROS

中文名称

高通 美国高通公司

数据手册

下载地址下载地址二

更新时间

2025-8-9 20:00:00

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APQ8096SG价格和库存,欢迎联系客服免费人工找货

APQ8096SG规格书详情

描述 Description

The Qualcomm® APQ8096SG application processor features leading-edge premium mobile technology for powering next-generation devices, while supporting the ultimate in performance and power efficiency, ideal for small form factors and a wide variety of innovative and intelligent IoT applications.

特性 Features

• CPU
- CPU Clock Speed: Up to 2.15 GHz
- CPU Cores: Quad-core CPU, 4x Qualcomm® Kryo™ CPU
- CPU Bit Architecture: 64-bit
• Process
- Process Technology: 14 nm
• DSP
- DSP Technology: Qualcomm® Hexagon™ DSP
• Wi-Fi
- Wi-Fi Standards: 802.11ac
- Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
- MIMO Configuration: 2x2 (2-stream)
- Wi-Fi Features: MU-MIMO
• Bluetooth
- Bluetooth Version: Bluetooth 4.2
• Location
- Satellite Systems Support: GPS, GLONASS
• USB
- USB Version: USB 3.0, USB 2.0
• Camera
- Megapixel Support: Up to 28 MP camera
- Image Signal Processor: 2x Image Signal Processor (ISP)
• Video
- Video Capture: Up to 4K Ultra HD video capture @ 60 FPS
- Video Playback: Up to 4K Ultra HD video playback @ 60 fps
- Codec Support: H.265 (HEVC), H.264 (AVC)
• Display
- Concurrent Displays: Up to 3; 2 panels + external
- UI FPS: Up to 60 FPS, 3840x2400
• GPU
- GPU Name: Qualcomm® Adreno™ 530 GPU
- API Support: Path Rendering, OpenCL 2.0 Full, RenderScript-Next, OpenGL ES GEP, GL4.4, DX11.3/4, OpenGL ES 3.1, OpenGL ES 3.0
• Security Support
- Security Features: Secure code signing service, Secure Boot
• Memory
- Memory speed: 1866MHz
- Memory Type: Dual-Channel, LPDDR4
• Storage
- eMMC: eMMC 5.1
- UFS: UFS 2.0
- SD: SD 3.0 (UHS-I)
• Interface
- Supported Interfaces: SLIMbus, TSIF, I²S, MIPI-CSI, MIPI-DSI, PCIe 2.0, PCM, USB 2.0, USB 3.0
• Package
- Package Type: NSP, 994-pin NSP
- Package Size: 15.6 x 15 x 0.64mm
- Pitch: 0.4mm Pitch
Gold Cluster = 2x high-performance Kryo cores up to 2.15GHz, Silver Cluster = 2x low power Kryo cores up to 1.593GHzDoes not include memory deviceQualcomm Snapdragon, Qualcomm Adreno, Qualcomm Kryo, Qualcomm Hexagon and Qualcomm Location are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

供应商 型号 品牌 批号 封装 库存 备注 价格
QUALCOMM/高通
24+
NA/
200
优势代理渠道,原装正品,可全系列订货开增值税票
询价
QUALCOMM/高通
25+
BGA
200
原装正品,欢迎来电咨询!
询价
APLUS
20+
DIP28
19570
原装优势主营型号-可开原型号增税票
询价
APLUS
23
DIP
30000
代理全新原装现货 价格优势
询价
APLUS
0849+
DIP
365
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
QUALC0M
2450+
BGA
8850
只做原装正品假一赔十为客户做到零风险!!
询价
Qualcomm
23+
BGA
226
专注配单,只做原装进口现货
询价
QUALC0M
16+
BGA
880000
明嘉莱只做原装正品现货
询价
QUALCOMM/高通
22+
BGA
8000
原装正品支持实单
询价
APLUS
24+
DIP
90000
一级代理商进口原装现货、价格合理
询价