AM62A1-Q1中文资料适用于 1-2 个摄像头、低功耗系统且具有 RGB-IR ISP 和视频编码/解码功能的汽车处理器数据手册TI规格书
AM62A1-Q1规格书详情
描述 Description
AM62Ax is an extension of the Sitara™ automotive-grade family of heterogeneous Arm® processors with embedded Deep Learning (DL), Video and Vision Processing acceleration, display interface and extensive automotive peripheral and networking options. AM62Ax is built for a set of cost-sensitive automotive applications including driver and in-cabin monitoring systems, next generation of eMirror system, as well as a broad set of industrial applications in Factory Automation, Building Automation, Robotics, and other markets. The cost optimized AM62Ax provides high-performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in stand-alone Electronic Control Units (ECUs).
AM62Ax contains up to four Arm® Cortex®-A53 cores with 64-bit architecture, a Vision Processing Accelerator (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators, Deep Learning (DL) and video accelerators, a Cortex®-R5F MCU Channel core and a Cortex®-R5F Device Management core. The Cortex-A53s provide the powerful computing elements necessary for Linux applications as well as the implementation of traditional vision computing based-algorithms such as driver monitoring. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite including RGB-InfraRed (RGB-IR), support for higher bit depth, and features targeting analytics applications. Key cores include the next generation C7000™ DSP from Texas Instruments (“C7x”) with scalar and vector cores, dedicated “MMA” deep learning accelerator enabling performance up to 2 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C.
The 3-port Gigabit Ethernet switch has one internal port and two external ports with TSN support and can be used to enable industrial networking options. In addition, an extensive peripherals set is included in AM62Ax to enable system level connectivity such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. AM62Ax supports secure boot for IP protection with the built-in HSM (Hardware Security Module) and also employs advanced power management support for portable and power-sensitive applications.
特性 Features
Processor Cores:
Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
512KB SRAM with SECDED ECC
Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
Deep Learning Accelerator based on Single-core C7x
C7x floating point, up to 40 GFLOPS, 256-bit Vector DSP at 1.0GHz
Matrix Multiply Accelerator (MMA), up to 2TOPS (8b) at 1.0GHz
64KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
1.25MB of L2 SRAM with SECDED ECC
Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators:
315MPixel/s ISP; Up to 5MP @ 60fps
Support for 12-bit RGB-IR
Support for up to 16-bit input RAW format
Line support up to 4096
Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL
Multimedia:
Display subsystem
Single display support
Up to 2048x1080 @ 60fps
Up to 165MHz pixel clock support with independent PLL
DPI 24-bit RGB parallel interface
Supports safety features such as freeze frame detection and MISR data check
One Camera Serial interface (CSI-2) Receiver with 4-Lane D-PHY
MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane
ECC verification/correction with CRC check + ECC on RAM
Virtual Channel support (up to 16)
Ability to write stream data directly to DDR via DMA
Video Encoder/Decoder
Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
Support for H.264 BaseLine/Main/High Profiles at Level 5.2
Support for up to 4K UHD resolution (3840 × 2160)
Clocking options supporting 240MPixels/s, 120MPixels/s, or 60MPixels/s
Motion JPEG encode at 416MPixels/s withresolutions up to 4K UHD (3840 × 2160)
Memory Subsystem:
Up to 2.29MB of On-chip RAM
64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
1.25MB of L2 SRAM with SECDED ECC in C7x Deep Learning Accelerator
DDR Subsystem (DDRSS)
Supports LPDDR4
32-bit data bus with inline ECC
Supports speeds up to 3733MT/s
Max addressable range of 8GBytes
Functional Safety:
Functional Safety-Compliant targeted [Industrial]
Developed for functional safety applications
Documentation will be available to aid IEC 61508 functional safety system design
Systematic capability up to SIL 3 targeted
Hardware Integrity up to SIL 2 targeted
Safety-related certification
IEC 61508 by TÜV SÜD planned
Functional Safety-Compliant targeted [Automotive]
Developed for functional safety applications
Documentation will be available to aid ISO 26262 functional safety system design
Systematic capability up to ASIL D targeted
Hardware integrity up to ASIL B targeted
Safety-related certification
ISO 26262 by TÜV SÜD planned
AEC - Q100 qualified [Automotive]
Security:
Secure boot supported
Hardware-enforced Root-of-Trust (RoT)
Support to switch RoT via backup key
Support for takeover protection, IP protection, and anti-roll back protection
Trusted Execution Environment (TEE) supported
Arm TrustZone based TEE
Extensive firewall support for isolation
Secure watchdog/timer/IPC
Secure storage support
Replay Protected Memory Block (RPMB) support
Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
Cryptographic acceleration supported
Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
Supports cryptographic cores
AES – 128-/192-/256-Bit key sizes
SHA2 – 224-/256-/384-/512-Bit key sizes
DRBG with true random number generator
PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
Debugging security
Secure software controlled debug access
Security aware debugging
High-Speed Interfaces:
Integrated Ethernet switch supporting (total 2 external ports)
RMII(10/100) or RGMII (10/100/1000)
IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
Clause 45 MDIO PHY management
Packet Classifier based on ALE engine with 512 classifiers
Priority based flow control
Time Sensitive Networking (TSN) support
Four CPU H/W interrupt Pacing
IP/UDP/TCP checksum offload in hardware
Two USB2.0 Ports
Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
Integrated USB VBUS detection
General Connectivity:
9x Universal Asynchronous Receiver-Transmitters (UART)
5x Serial Peripheral Interface (SPI) controllers
6x Inter-Integrated Circuit (I2C) ports
3x Multichannel Audio Serial Ports (McASP)
Transmit and Receive Clocks up to 50MHz
Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
FIFO Buffers for Transmit and Receive (256 Bytes)
Support for audio reference output clock
3x enhanced PWM modules (ePWM)
3x enhanced Quadrature Encoder Pulse modules (eQEP)
3x enhanced Capture modules (eCAP)
General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
3x Controller Area Network (CAN) modules with CAN-FD support
Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
Full CAN FD support (up to 64 data bytes)
Parity/ECC check for Message RAM
Speed up to 8Mbps
Media and Data Storage:
3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
1x 8-bit eMMC interface up to HS200 speed
2x 4-bit SD/SDIO interface up to UHS-I
Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
1× General-Purpose Memory Controller (GPMC) up to 133MHz
Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
Uses BCH code to support 4-, 8-, or 16-bit ECC
Uses Hamming code to support 1-bit ECC
Error Locator Module (ELM)
Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
OSPI/QSPI with DDR / SDR support
Support for Serial NAND and Serial NOR Flash devices
4GBytes memory address support
XIP mode with optional on-the-fly encryption
Power Management:
Low-power modes supported by Device/Power Manager
Partial IO support for CAN/GPIO/UART wakeup
DeepSleep : I/O + DDR (suspend to RAM)
DeepSleep
MCU Only
Standby
Dynamic frequency scaling for Cortex-A53
Boot Options:
UART
I2C EEPROM
OSPI/QSPI Flash
GPMC NOR/NAND Flash
Serial NAND Flash
SD Card
eMMC
USB (host) boot from Mass Storage device
USB (device) boot from external host (DFU mode)
Ethernet
Technology / Package:
16-nm FinFET technology
18mm x 18mm, 0.8mm pitch full-array, 484-pin FCBGA (AMB)
18mm x 18mm, 0.8mm pitch full-array, 484-pin FCCSP (ANF)
技术参数
- 制造商编号
:AM62A1-Q1
- 生产厂家
:TI
- TI functional safety category
:Functional Safety-Compliant
- Rating
:Automotive
- Operating temperature range (°C)
:-40 to 125
- 封装
:FCCSP (ANF)
- 引脚
:484
- 尺寸
:324 mm² 18 x 18
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMD |
22+ |
DIP |
8200 |
全新原装现货!自家库存! |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
询价 | ||
INTEL |
2447 |
BGA |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
询价 | |||
AMD |
23+ |
BGA |
7300 |
专注配单,只做原装进口现货 |
询价 | ||
AMD |
23+ |
BGA |
7000 |
询价 | |||
AMD |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
询价 | |||
24+ |
N/A |
54000 |
一级代理-主营优势-实惠价格-不悔选择 |
询价 | |||
Anatech |
1653 |
询价 |