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AM62A1-Q1中文资料适用于 1-2 个摄像头、低功耗系统且具有 RGB-IR ISP 和视频编码/解码功能的汽车处理器数据手册TI规格书

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厂商型号

AM62A1-Q1

功能描述

适用于 1-2 个摄像头、低功耗系统且具有 RGB-IR ISP 和视频编码/解码功能的汽车处理器

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-9-23 16:10:00

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AM62A1-Q1规格书详情

描述 Description

AM62Ax is an extension of the Sitara™ automotive-grade family of heterogeneous Arm® processors with embedded Deep Learning (DL), Video and Vision Processing acceleration, display interface and extensive automotive peripheral and networking options. AM62Ax is built for a set of cost-sensitive automotive applications including driver and in-cabin monitoring systems, next generation of eMirror system, as well as a broad set of industrial applications in Factory Automation, Building Automation, Robotics, and other markets. The cost optimized AM62Ax provides high-performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in stand-alone Electronic Control Units (ECUs).

AM62Ax contains up to four Arm® Cortex®-A53 cores with 64-bit architecture, a Vision Processing Accelerator (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators, Deep Learning (DL) and video accelerators, a Cortex®-R5F MCU Channel core and a Cortex®-R5F Device Management core. The Cortex-A53s provide the powerful computing elements necessary for Linux applications as well as the implementation of traditional vision computing based-algorithms such as driver monitoring. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite including RGB-InfraRed (RGB-IR), support for higher bit depth, and features targeting analytics applications. Key cores include the next generation C7000™ DSP from Texas Instruments (“C7x”) with scalar and vector cores, dedicated “MMA” deep learning accelerator enabling performance up to 2 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with TSN support and can be used to enable industrial networking options. In addition, an extensive peripherals set is included in AM62Ax to enable system level connectivity such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. AM62Ax supports secure boot for IP protection with the built-in HSM (Hardware Security Module) and also employs advanced power management support for portable and power-sensitive applications.

特性 Features

Processor Cores:

Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz

Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC

Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection



Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI

32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories

512KB SRAM with SECDED ECC



Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management

32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories



Deep Learning Accelerator based on Single-core C7x

C7x floating point, up to 40 GFLOPS, 256-bit Vector DSP at 1.0GHz

Matrix Multiply Accelerator (MMA), up to 2TOPS (8b) at 1.0GHz

64KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection

1.25MB of L2 SRAM with SECDED ECC





Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators:

315MPixel/s ISP; Up to 5MP @ 60fps

Support for 12-bit RGB-IR

Support for up to 16-bit input RAW format

Line support up to 4096

Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support

Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL





Multimedia:

Display subsystem

Single display support

Up to 2048x1080 @ 60fps

Up to 165MHz pixel clock support with independent PLL

DPI 24-bit RGB parallel interface

Supports safety features such as freeze frame detection and MISR data check



One Camera Serial interface (CSI-2) Receiver with 4-Lane D-PHY

MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2

Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane

ECC verification/correction with CRC check + ECC on RAM

Virtual Channel support (up to 16)

Ability to write stream data directly to DDR via DMA



Video Encoder/Decoder

Support for HEVC (H.265) Main profiles at Level 5.1 High-tier

Support for H.264 BaseLine/Main/High Profiles at Level 5.2

Support for up to 4K UHD resolution (3840 × 2160)

Clocking options supporting 240MPixels/s, 120MPixels/s, or 60MPixels/s





Motion JPEG encode at 416MPixels/s withresolutions up to 4K UHD (3840 × 2160)

Memory Subsystem:

Up to 2.29MB of On-chip RAM

64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks

256KB of On-Chip RAM with SECDED ECC in SMS Subsystem

176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware

512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem

64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem

1.25MB of L2 SRAM with SECDED ECC in C7x Deep Learning Accelerator



DDR Subsystem (DDRSS)

Supports LPDDR4

32-bit data bus with inline ECC

Supports speeds up to 3733MT/s

Max addressable range of 8GBytes



Functional Safety:

Functional Safety-Compliant targeted [Industrial]

Developed for functional safety applications

Documentation will be available to aid IEC 61508 functional safety system design

Systematic capability up to SIL 3 targeted

Hardware Integrity up to SIL 2 targeted

Safety-related certification

IEC 61508 by TÜV SÜD planned





Functional Safety-Compliant targeted [Automotive]

Developed for functional safety applications

Documentation will be available to aid ISO 26262 functional safety system design

Systematic capability up to ASIL D targeted

Hardware integrity up to ASIL B targeted

Safety-related certification

ISO 26262 by TÜV SÜD planned





AEC - Q100 qualified [Automotive]

Security:

Secure boot supported

Hardware-enforced Root-of-Trust (RoT)

Support to switch RoT via backup key

Support for takeover protection, IP protection, and anti-roll back protection



Trusted Execution Environment (TEE) supported

Arm TrustZone based TEE

Extensive firewall support for isolation

Secure watchdog/timer/IPC

Secure storage support

Replay Protected Memory Block (RPMB) support



Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing

Cryptographic acceleration supported

Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream

Supports cryptographic cores



AES – 128-/192-/256-Bit key sizes

SHA2 – 224-/256-/384-/512-Bit key sizes

DRBG with true random number generator

PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot



Debugging security

Secure software controlled debug access

Security aware debugging



High-Speed Interfaces:

Integrated Ethernet switch supporting (total 2 external ports)

RMII(10/100) or RGMII (10/100/1000)

IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)

Clause 45 MDIO PHY management

Packet Classifier based on ALE engine with 512 classifiers

Priority based flow control

Time Sensitive Networking (TSN) support

Four CPU H/W interrupt Pacing

IP/UDP/TCP checksum offload in hardware



Two USB2.0 Ports

Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)

Integrated USB VBUS detection



General Connectivity:

9x Universal Asynchronous Receiver-Transmitters (UART)

5x Serial Peripheral Interface (SPI) controllers

6x Inter-Integrated Circuit (I2C) ports

3x Multichannel Audio Serial Ports (McASP)

Transmit and Receive Clocks up to 50MHz

Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks

Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats

Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)

FIFO Buffers for Transmit and Receive (256 Bytes)

Support for audio reference output clock



3x enhanced PWM modules (ePWM)

3x enhanced Quadrature Encoder Pulse modules (eQEP)

3x enhanced Capture modules (eCAP)

General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO

3x Controller Area Network (CAN) modules with CAN-FD support

Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1

Full CAN FD support (up to 64 data bytes)

Parity/ECC check for Message RAM

Speed up to 8Mbps



Media and Data Storage:

3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface

1x 8-bit eMMC interface up to HS200 speed

2x 4-bit SD/SDIO interface up to UHS-I

Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0



1× General-Purpose Memory Controller (GPMC) up to 133MHz

Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)

Uses BCH code to support 4-, 8-, or 16-bit ECC

Uses Hamming code to support 1-bit ECC

Error Locator Module (ELM)

Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm

Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms





OSPI/QSPI with DDR / SDR support

Support for Serial NAND and Serial NOR Flash devices

4GBytes memory address support

XIP mode with optional on-the-fly encryption



Power Management:

Low-power modes supported by Device/Power Manager

Partial IO support for CAN/GPIO/UART wakeup

DeepSleep : I/O + DDR (suspend to RAM)

DeepSleep

MCU Only

Standby

Dynamic frequency scaling for Cortex-A53



Boot Options:

UART

I2C EEPROM

OSPI/QSPI Flash

GPMC NOR/NAND Flash

Serial NAND Flash

SD Card

eMMC

USB (host) boot from Mass Storage device

USB (device) boot from external host (DFU mode)

Ethernet

Technology / Package:

16-nm FinFET technology

18mm x 18mm, 0.8mm pitch full-array, 484-pin FCBGA (AMB)

18mm x 18mm, 0.8mm pitch full-array, 484-pin FCCSP (ANF)

技术参数

  • 制造商编号

    :AM62A1-Q1

  • 生产厂家

    :TI

  • TI functional safety category

    :Functional Safety-Compliant

  • Rating

    :Automotive

  • Operating temperature range (°C)

    :-40 to 125

  • 封装

    :FCCSP (ANF)

  • 引脚

    :484

  • 尺寸

    :324 mm² 18 x 18

供应商 型号 品牌 批号 封装 库存 备注 价格
AMD
22+
DIP
8200
全新原装现货!自家库存!
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
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INTEL
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
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TI/德州仪器
25+
原厂封装
10280
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AMD
23+
BGA
7300
专注配单,只做原装进口现货
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AMD
23+
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7000
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AMD
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
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TI/德州仪器
25+
原厂封装
10280
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24+
N/A
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一级代理-主营优势-实惠价格-不悔选择
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Anatech
1653
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