AM2732数据手册集成电路（IC）的微处理器规格书PDF

描述 Description

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

特性 Features

Processor Cores:
• Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing
• Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
• 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
• Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
• Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)

• TMS320C66x DSP core
• Single core, 32-bit, floating point DSP
• Operating at 450 MHz (14.4 GMAC)

Memory subsystem:
• Up to 5.0 MB On Chip RAM (OCSRAM)
• Memory space sharable between DSP, MCU, and shared L3
• 3.5625MB shared L3 memory
• 960KB dedicated to Main subsystem
• 384KB dedicated to DSP subsystem

• External Memory Interfaces (EMIF)
• QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:
• 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
• 5x Real-Time Interrupt (RTI) modules
• Mailbox system for Interprocessor Communication (IPC)
• JTAG/Trace interfaces for device debugging
• Clock source
• 40.0 MHz crystal with internal oscillator
• Supports external oscillator at 40/50 MHz
• Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:
• 10/100 Mbps Ethernet (RGMII/RMII/MII)
• Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
• Output: 4-lane Aurora/LVDS
General Connectivity Peripherals:
• General Purpose Analog to Digital Converters (GPADC)
• 1x 9-channel ADC supporting up to 625 Ksps

• Digital Connectivity
• 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
• 3x Inter-Integrated Circuit (I2C) ports
• 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:
• 3x Enhanced Pulse-Width Modulator (ePWM)
• 1x Enhanced Capture Module (eCAP)
• 2x Modular Controller Area Network (MCAN) modules with CAN-FD support
Power Management:
• Simplified power sequencing and reduced number of power supply rails
• Dual voltage digital I/O supporting 3.3V and 1.8V operation
Security:
• Device Security
• Programmable embedded Hardware Security Module (HSM)
• Secure authenticated and encrypted boot support
• Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
• Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:
• Functional Safety-Compliant targeted
• Developed for functional safety applications
• Documentation will be available to aid ISO 26262 functional safety system design
• Hardware integrity up to ASIL B targeted
• Safety-related certification
• ISO 26262 certification by TÜV SÜD planned


• AEC-Q100 qualification targeted
• Operating Conditions
• Automotive grade temperature range supported
• Industrial grade temperature range supported

Package options:
• ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
• 45-nm technology
• Compact solution size