丝印：AIW；Package：8LdMSOP；Low Noise, Low Power, 32 Taps Digitally Controlled Potentiometer (XDCP??

文件：433.56 Kbytes 页数：8 Pages

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AI Inference System Powered by NVIDIA® Jetson Orin™ NX for Railway Applications

Features ƒ Fanless system designed for AI inference ƒ Embedded NVIDIA® Jetson Orin™ NX platform ƒ Compliant with EN 50155 OT3 and EN 50121-3-2 EMC standards ƒ Rugged M12 connectors suitable for harsh, industrial environments ƒ 1 x Mini PCIe, 1 x M.2 (E-key),1 x M.2 (M-key) and 1 x M.2 (B-key)

文件：489.41 Kbytes 页数：2 Pages

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AI Inference Box Computer Powered by NVIDIA® Jetson Orin™ NX for Railway Applications

Features ƒ Fanless box computer designed for AI inference ƒ Embedded NVIDIA® Jetson Orin™ NX platform ƒ Compliant with EN 50155 OT3 and EN 50121-3-2 EMC standards ƒ Rugged M12 connectors suitable for harsh, industrial environments ƒ 1 x Mini PCIe, 1 x M.2 (E-key),1 x M.2 (M-key) and 1 x M.2 (

文件：541.16 Kbytes 页数：2 Pages

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ƒ IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ƒ Supports MU-MIMO (2T2R) ƒ Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ƒ Supports Linux OS ƒ M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：386.39 Kbytes 页数：1 Pages

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ƒ IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ƒ Supports MU-MIMO (2T2R) ƒ Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ƒ Supports Linux OS ƒ M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：386.39 Kbytes 页数：1 Pages

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NXP i.MX8M Plus Cortex®-A53 Edge AI RISC-based Box Computer

Features ƒ NXP i.MX8M Plus Cortex®-A53 Quad Core 1.6GHz ƒ On-board LPDDR4 6 GB, 4000MT/s memory ƒ HDMI up to 3840 x 2160 at 30Hz resolution ƒ Dual GbE LAN, 1 USB2.0 and 1 USB3.2 Gen 1 ƒ 1 Micro SD Socket & 1 Nano SIM Slot ƒ 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot ƒ Yocto Linux and Andr

文件：3.13995 Mbytes 页数：4 Pages

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NXP i.MX8M Plus Cortex®-A53 2.5 SBC with UIO40-Express

Features ƒ NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz ƒ Onboard LPDDR4 4 GB/ 6 GB, 4000MT/s memory ƒ HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) ƒ 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. i

文件：3.95121 Mbytes 页数：6 Pages

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IEEE 802.11ax/ac/a/b/g/n Bluetooth 5.2 M.2 2230 (A-E Key) Card

Features ƒ IEEE 802.11ax/a/b/g/n + Bluetooth 5.2 ƒ Supports 2.4 GHz: 2.412 ~ 2.484 GHz , 5 GHz: 4.915 ~5.925GHz ƒ MU-MIMO, 2Tx/2Rx ƒ Operating temperature: 0~ 70°C (32~158°F)

文件：312.76 Kbytes 页数：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：352.73 Kbytes 页数：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：352.73 Kbytes 页数：1 Pages

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