丝印：AHC04；Package：WQFN；SNx4AHC04 HEX INVERTERS

1 Features • Operating range of 2 V to 5.5 V • Latch-up performance exceeds 250 mA per JESD 17 2 Description The 'AHC04 devices contain six independent inverters. These devices perform the Boolean function Y = A.

文件：2.72106 Mbytes 页数：35 Pages

TI

德州仪器

丝印：AHC04；Package：SOIC；SNx4AHC04 HEX INVERTERS

1 Features • Operating range of 2 V to 5.5 V • Latch-up performance exceeds 250 mA per JESD 17 2 Description The 'AHC04 devices contain six independent inverters. These devices perform the Boolean function Y = A.

文件：2.72106 Mbytes 页数：35 Pages

TI

德州仪器

丝印：AHC04；Package：SOIC；SNx4AHC04 HEX INVERTERS

1 Features • Operating range of 2 V to 5.5 V • Latch-up performance exceeds 250 mA per JESD 17 2 Description The 'AHC04 devices contain six independent inverters. These devices perform the Boolean function Y = A.

文件：2.72106 Mbytes 页数：35 Pages

TI

德州仪器

丝印：AHC04；Package：SO；SNx4AHC04 HEX INVERTERS

1 Features • Operating range of 2 V to 5.5 V • Latch-up performance exceeds 250 mA per JESD 17 2 Description The 'AHC04 devices contain six independent inverters. These devices perform the Boolean function Y = A.

文件：2.72106 Mbytes 页数：35 Pages

TI

德州仪器

丝印：AHC04MEP；Package：SOIC；HEX INVERTER

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† EPIC (Enhanced-Performance Implanted CMOS) Process

文件：211.43 Kbytes 页数：10 Pages

TI

德州仪器

丝印：AHC04MEP；Package：SOIC；HEX INVERTER

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† EPIC (Enhanced-Performance Implanted CMOS) Process

文件：211.43 Kbytes 页数：10 Pages

TI

德州仪器

丝印：AHC04EP；Package：TSSOP；HEX INVERTER

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† EPIC (Enhanced-Performance Implanted CMOS) Process

文件：211.43 Kbytes 页数：10 Pages

TI

德州仪器

丝印：AHC04EP；Package：TSSOP；HEX INVERTER

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† EPIC (Enhanced-Performance Implanted CMOS) Process

文件：211.43 Kbytes 页数：10 Pages

TI

德州仪器

丝印：AHC04Q；Package：SOIC；HEX INVERTER

Q Devices Meet Automotive Performance Requirements Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval EPIC (Enhanced-Performance Implanted CMOS) Process Operating Range 2-V to 5.5-V VCC Latch-Up Performance Exceeds 250 mA Per JESD 17 description

文件：339.62 Kbytes 页数：9 Pages

TI

德州仪器

丝印：AHC04Q；Package：SOIC；HEX INVERTER

Q Devices Meet Automotive Performance Requirements Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval EPIC (Enhanced-Performance Implanted CMOS) Process Operating Range 2-V to 5.5-V VCC Latch-Up Performance Exceeds 250 mA Per JESD 17 description

文件：339.62 Kbytes 页数：9 Pages

TI

德州仪器