AGQ20003数据手册继电器的信号继电器高达2A规格书PDF

描述 Description

FEATURES
• Compact flat body saves space
  With a small footprint of 10.6 mm (L) × 7.2 mm (W) .417 inch (L) × .283 inch (W) for space savings, it also has a very short height of 5.2 mm .205 inch. (Standard PC board type.)
• Outstanding surge resistance.
   Surge withstand between open contacts:  1,500 V 10×160 µs (FCC part 68)
   Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)
• The use of twin crossbar contacts ensures high contact reliability.
   AgPd contact is used because of its good  sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.
• Increased packaging density
   Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.
• Nominal operating power: 140 mW
• Outstanding vibration and shock resistance.
   Functional shock resistance: 750 m/s2 {75G}
   Destructive shock resistance: 1,000 m/s2 {100G}
   Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3  mm .130 inch)
   Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)

特性 Features

• Compact flat body saves space
  With a small footprint of 10.6 mm (L) × 7.2 mm (W) .417 inch (L) × .283 inch (W) for space savings, it also has a very short height of 5.2 mm .205 inch. (Standard PC board type.)
• Outstanding surge resistance.
   Surge withstand between open contacts:  1,500 V 10×160 µs (FCC part 68)
   Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)
• The use of twin crossbar contacts ensures high contact reliability.
   AgPd contact is used because of its good  sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.
• Increased packaging density
   Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.
• Nominal operating power: 140 mW
• Outstanding vibration and shock resistance.
   Functional shock resistance: 750 m/s2 {75G}
   Destructive shock resistance: 1,000 m/s2 {100G}
   Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3  mm .130 inch)
   Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)