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AFS600集成电路(IC)的FPGA(现场可编程门阵列)规格书PDF中文资料

AFS600
厂商型号

AFS600

参数属性

AFS600 封装/外壳为208-BFQFP;包装为托盘;类别为集成电路(IC)的FPGA(现场可编程门阵列);产品描述:IC FPGA 95 I/O 208QFP

功能描述

Terrestrial FPGA and SoC Product Catalog
IC FPGA 95 I/O 208QFP

封装外壳

208-BFQFP

文件大小

1.89333 Mbytes

页面数量

27

生产厂商 Microsemi Corporation
企业简称

MICROSEMI美高森美

中文名称

美高森美公司官网

原厂标识
MICROSEMI
数据手册

原厂下载下载地址一下载地址二到原厂下载

更新时间

2025-8-4 19:00:00

人工找货

AFS600价格和库存,欢迎联系客服免费人工找货

AFS600规格书详情

AFS600属于集成电路(IC)的FPGA(现场可编程门阵列)。由美高森美公司制造生产的AFS600FPGA(现场可编程门阵列)FPGA 是用于执行逻辑运算和信息处理的用户可配置集成电路产品,通常具有非常高级别的集成功能。这些器件通常用于代替通用微处理器,其中已知运算将以极高的速度执行,例如用于接收和处理来自高速数据转换器的信息。它们通常需要外部存储设备来存储用户所需的配置,并在启动时重新加载这些配置。

Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†

• FlashLock® to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory†

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

• M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug

产品属性

更多
  • 产品编号:

    AFS600-1PQ208

  • 制造商:

    Microsemi Corporation

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Fusion®

  • 包装:

    托盘

  • 电压 - 供电:

    1.425V ~ 1.575V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    208-BFQFP

  • 供应商器件封装:

    208-PQFP(28x28)

  • 描述:

    IC FPGA 95 I/O 208QFP

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