丝印：AF5A；Package：SOT-23；LMP202x Zero-Drift, Low-Noise, EMI-Hardened Amplifiers

1 Features 1(Typical Values, TA = 25°C, VS = 5 V) • Input Offset Voltage (Typical) −0.4 μV • Input Offset Voltage (Max) ±5 μV • Input Offset Voltage Drift (Typical) –0.004 μV/°C • Input Offset Voltage Drift (Max) ±0.02 μV/°C • Input Voltage Noise, AV = 1000 11 nV/√Hz • Open Loop Gain 160 dB

文件：1.18859 Mbytes 页数：42 Pages

TI

德州仪器

丝印：AF5A；Package：SOT-23；LMP202x Zero-Drift, Low-Noise, EMI-Hardened Amplifiers

1 Features 1(Typical Values, TA = 25°C, VS = 5 V) • Input Offset Voltage (Typical) −0.4 μV • Input Offset Voltage (Max) ±5 μV • Input Offset Voltage Drift (Typical) –0.004 μV/°C • Input Offset Voltage Drift (Max) ±0.02 μV/°C • Input Voltage Noise, AV = 1000 11 nV/√Hz • Open Loop Gain 160 dB

文件：1.18859 Mbytes 页数：42 Pages

TI

德州仪器

70nH, 15%, 0.19 mOhm, 92A Max. SMD Power Bead

• Ferrite based SMD inductor with lower core loss• Inductance Range: 50.0nH to 70.0nH, Custom values are welcomed• High current output chokes, up to 130.0 Amp with approx. 20% roll off• Low Profile 4.30 mm Max. height• Foot Print 12.80 x 5.00 mm• Perfect for high density designs with limited boa

ITG

Step-Down (Buck) Converter

AF

科信电子

Step-Down (Buck) Converter

AF

科信电子

包装：散装 类别：风扇，热管理 热 - 垫，片 描述：THERM PAD 15MMX15MM 1 SHT=378PC

CUID

包装：散装 类别：风扇，热管理 热 - 垫，片 描述：THERM PAD 15MMX30MM 1 SHEET=92PC

CUID