AD9084-DF中文资料亚德诺数据手册PDF规格书

FEATURES

► Flexible reconfigurable common platform design

► 4 DACs and 4 ADCs (4D4A)

► Usable RF Analog bandwidth up to 18 GHz

► Maximum DAC/ADC sample rate up to 28 GSPS/20 GSPS

► DAC to ADC sample rate ratios of 1 and 2

► Clocking

► On-chip PLL (7 GHz to 14 GHz)

► External RFCLK input up to 20 GHz

► Multichip synchronization via subclass1

► Single-ended (SE) or differential (DIFF) ADC inputs

► Two separate versions, both 50 Ω input impedance

► Single-ended version with on-chip wide bandwidth balun

► Differential ADC AC performance at 20 GSPS

► Full-scale input voltage: 500 mV p-p/−2 dBm

► Noise density: −150 dBFS/Hz at −20 dBFS at 2 GHz

► HD2/HD3: −65 dBFS/−70 dBFS at −7 dBFS at 2 GHz

► IMD3: −75 dBFS at – 13 dBFS/tone at 2 GHz

► DAC AC performance at 28 GSPS

► Full-scale output power: −2.1 dBm at 2 GHz

► IMD3: −75 dBc at – 13 dBFS/tone at 2 GHz to 10 GHz

► NSD (shuffling disabled): −164 dBFS/Hz at 0 dBFS at 2 GHz

► Versatile digital features

► Supports real or complex digital data (8-, 12-, 16-bit)

► Configurable DDC and DUC

► 8 fine complex DUCs and 4 coarse complex DUCs

► 8 fine complex DDCs and 4 coarse complex DDCs

► Option to bypass fine and coarse DUC/DDC

► DUC/DDC alias rejection

► 85 dB for interpolation filters

► 100 dB for decimation filters

► Fractional sample rate converter (FSRC)

► Programmable FIR filters for transmit/receive

► Multiple loopback (ADC to DAC) supported

► ~45 ns without DSP path

► Dynamic configuration through SPI/HSCI/GPIO

► Spectrum sniffer/monitor

► Interfaces

► SPI

► High-Speed Control Interface (HSCI)

► JESD204B/JESD204C: 20 Gbps/32.5 Gbps

► 24 lanes for Rx, 24 lanes for Tx

► Receive AGC support

► Fast detect with low latency for fast AGC control

► Signal monitor for slow AGC control

► Auxiliary features

► Power amplifier downstream protection circuitry

► On-chip temperature monitoring unit

► TDD power savings option

► Total power consumption range dependent on device configuration

: 20 W to 30 W

► 24 mm × 26 mm, 899-ball BGA with 0.8 mm pitch

► Operating junction temperature (TJ): −40°C to +110°C

APPLICATIONS

► Radar and communications

► L/S/C/X/Ku band radar and electronic warfare

► Phase array system

► Broadband communications systems

► Electronic test and measurement systems

► Satellite communications

► Microwave point-to-point, X-band and 5G mmWave