ACT8870QJ101-T中文资料威讯联合数据手册PDF规格书

BENEFITS and FEATURES

• Wide input voltage range

• Vin = 2.8V to 5.5V

• Complete integrated power solution

• One 4A DC/DC Step-Down (Buck) Regulator

• Three 2.5A DC/DC Step-Down (Buck) Regulators

• One 800mA LDO

• Two 200mA LDOs

• Space Savings

• Fully integrated

• High Fsw =2.25MHz or 1.125MHz

• Integrated sequencing

• Easy system level design

• Configurable sequencing

• Seamless sequencing with external supplies

• Buck 1 Bypass Mode for 3.3V system level compliance

• Highly configurable

• uP interface for status reporting and controllability

• Programmable Reset and Power Good GPIO’s

• Flexible Sequencing Options

• I2C Interface – 1MHz

APPLICATIONS

• Microcontroller Applications

• Solid-State Drives

• FPGA

• Video Processor

GENERAL DESCRIPTION

The ACT8870 PMIC is an integrated ActivePMU power management unit. It is designed to power a wide range of processors, including Atmel’s SAMA5D2, FPGA’s, peripherals, microcontrollers, and solid-state drive applications. It is highly flexible and can be reconfigured via I2C for multiple applications without the need for PCB changes. The low external component count and high configurability significantly speeds time to market. Examples of configurable options include output voltage, startup time, slew rate, system level sequencing, switching frequency, sleep modes, operating modes etc. ACT8870 is programmed at the factory with default configuration. These settings can be optimized for a specific design through the I2C interface. The ACT8870 comes in several default configuration. Contact the factory for specific default configurations.

The core of the device includes four DC/DC step down converters using integrated power FETs, three low-dropout regulators (LDOs), and an optional load switch. Each DC/DC regulator switches at 2.25MHz, requiring only three small components for operation. The LDOs only require small ceramic capacitors. All are highly configurable via the I2C interface.

The ACT8870 PMIC is available in a 5 x 5 mm 40 pin QFN package or a 3.2 x 4.2 mm 0.5mm 48 ball wafer chip-scale package.