High Density EERAM Evaluation Kit

Product Features 1 Mbit SPI and 64 Kbit I²C serial EERAM devices Follows the published recommended capacitor selection for the EERAM device Test points with probe loops for I²C signals, SPI signals, VCC and GND On-board pull-ups for I²C bus operation Jumper options for 3.3V and 5V operation

文件：547.76 Kbytes 页数：2 Pages

MICROCHIP

微芯科技

包装：散装 功能：EERAM 类别：开发板，套件，编程器 评估和演示板及套件 描述：HIGH DENSITY EERAM EVAL KIT

MICROCHIP

微芯科技

NexFET Power Stage

文件：376.22 Kbytes 页数：20 Pages

TI

德州仪器

bq500101 NexFET™ Power Stage

1 Features 1• 98% System Efficiency at 5 A • Max Rated Continuous Current 10 A, Peak 15 A • High-Frequency Operation (up to 600 kHz) • High-Density SON 3.5 × 4.5 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Input V

文件：431.83 Kbytes 页数：19 Pages

TI

德州仪器

NexFET Power Stage

文件：376.22 Kbytes 页数：20 Pages

TI

德州仪器