AAP661数据手册Microchip中文资料规格书

描述 Description

\"Electret Condenser Microphone (ECM) Pre-Amplifier w/Programmable HPFThe AAP661X ECM Pre Amplifiers were designed for the recent exclusive use of Plantronics, Inc. of Santa Cruz, CA for high end audio headset microphone applications. The AAP661X is now available for general sale to the audio microphone marketplace. The performance of this Pre-Amplifier is such that it enables design of enhanced end system products, due to its various gain options, ultralow noise and other high performance features.The AAP661X ECM Pre-Amplifier provides a number of performance advantages over prior ECM Pre-Amplifier products. Key features include ultra low input capacitance (0.35pF typical) and quiescent current (250?A typical), with ultra low equivalent input noise (1.9 to 2.5 ?V RMS, A-Weighted, with the microphone capacitor short circuited, gain version dependent). Additionally, the Pre-Amplifier sports a programmable high pass filter with operation down to 1.6V. Other key features include THD performance below 0.5% maximum,output impedance of 25? typical, with exceptionally high tolerance to RF interference and ESD tolerance (8kV).The AAP661X is offered with two gain options, 16dB and 19dB. Packaging is bumped chip scale SMD configuration, with a size of 930?m x 580?m and an overall thickness of 350?m (including solder bumps). Optimum for 3mm microphones, the die is RoHS compliant, with lead free solder pads of 118?m diameter. Packing styles available are 2” x 2” Waffle Pack or Tape and Reel.\"

特性 Features

Selectable gain configurations - 16dB and 19dB
Ultra low input capacitance - 0.35pF typical
Ultra low equivalent input noise performance - 1.9?VRMS to 2.5?VRMS (Cmic = SC, varies with gain)
8kV ESD tolerance
High RFI tolerance, low output impedance (25?)
Excellent THD performance (Ultra low quiescent current (250?A typical)
Chip-scale SMD bumped packaging (930?m x 580?m, 350?m thick)