Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†

• FlashLock® to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory†

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

• M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug

A3P125属于集成电路（IC） > FPGA（现场可编程门阵列）。美高森美公司制造生产的A3P125FPGA（现场可编程门阵列）FPGA 是用于执行逻辑运算和信息处理的用户可配置集成电路产品，通常具有非常高级别的集成功能。这些器件通常用于代替通用微处理器，其中已知运算将以极高的速度执行，例如用于接收和处理来自高速数据转换器的信息。它们通常需要外部存储设备来存储用户所需的配置，并在启动时重新加载这些配置。