A3P1000-1FG144M中文资料ACTEL数据手册PDF规格书

Features and Benefits

Military Temperature Tested and Qualified

• Each Device Tested from –55°C to 125°C

Firm-Error Immune

• Not Susceptible to Neutron-Induced Configuration Loss

Low Power

• Dramatic Reduction in Dynamic and Static Power

• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power†

• Low Power Consumption in Flash*Freeze Mode Allows for

Instantaneous Entry To / Exit From Low-Power Flash*Freeze

Modeƒ

• Supports Single-Voltage System Operation

• Low-Impedance Switches

High Capacity

• 600 k to 3 M System Gates

• Up to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Live-at-Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System

Performance

• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit

PCI (1.2 V systems)

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock® to Secure FPGA Contents

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization