A23KP-DF中文资料恩楷楷数据手册PDF规格书

Distinctive Characteristics

Subminiature size saves space on PC boards.

Specifcally developed for logic-level applications.

Totally sealed body construction prevents contact contamination and allows time- and moneysaving automated soldering and cleaning.

Award-winning STC contact mechanism with benefts unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement section.)

Molded-in, epoxy sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants.

.100” x .100” (2.54mm x 2.54mm) terminal spacing conforms to standard PC board grid spacing.

Matching indicators available and shown at the end of Section M.