98ASB42148B中文资料安森美半导体数据手册PDF规格书

The MBR2535CTG/45CTG series uses the Schottky Barrier

principle with a platinum barrier metal. These state−of−the−art

devices have the following features:

特性 Features

 Guardring for Stress Protection

 Low Forward Voltage

 175C Operating Junction Temperature

 These are Pb−Free Devices*

Mechanical Characteristics

 Case: Epoxy, Molded

 Epoxy Meets UL 94 V−0 @ 0.125 in

 Weight: 1.9 Grams (Approximately)

 Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

 Lead Temperature for Soldering Purposes:

260C Max. for 10 Seconds

*For additional information on our Pb−Free strategy and soldering details, please

download the onsemi Soldering and Mounting Techniques Reference Manual,

SOLDERRM/D.