98AON82777G中文资料安森美半导体数据手册PDF规格书

This LFPAK ultrafast rectifier provides fast switching performance

with soft recovery in a compact thermally efficient package. The

LFPAK package provides an excellent alternative to the DPAK,

offering thermal performance nearly as good in a package occupying

less than half the board space. Its low profile makes it a good option

for flat panel display and other applications with limited vertical

clearance. The device offers low leakage over temperature making it a

good match for applications requiring low quiescent current.

Features

• New Package Provides Capability of Inspection and Probe After

Board Mounting

• Low Forward Voltage Drop

• 175°C Operating Junction Temperature

• Excellent Ability to Absorb Stresses Associated with Power

Temperature Cycling

• NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics:

• Case: Epoxy, Molded

• Lead Finish: 100% Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements

Applications

• Excellent Alternative to DPAK in Space−Constrained Automotive

Applications

• Very Low Leakage for Higher Temperature Operation

• Output Rectification in Compact Portable Consumer Applications

• Freewheeling Diode used with Inductive Loads