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935153831510-F2T中文资料村田数据手册PDF规格书
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935153831510-F2T规格书详情
Ultra large band performance to 26 GHz
Resonance free
Phase stability
High rejection at 20 GHz
Ultra-high stability of capacitance value:
o Temperature 70ppm/K (-55 °C to +30 °C)
o Voltage <0.02/Volt
o Negligible capacitance loss through ageing
Low profile 0.25mm (standard), but lower thickness is possible (i.e 0.10mm) on request
Small size 0.5 x 0.5 mm (0202 format)
Break down voltage : 30V
Low leakage current < 70pA
High reliability
High operating temperature (up to 150 °C)
Compatible with high temperature cycling
during manufacturing operations (exceeding 300 °C)
Compatible with EIA 0202 footprint
Applicable for standard wire bonding assembly (ball and wedge)